Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

Abstract: A substrate bonding apparatus for manufacturing a liquid crystal display (LCD) device includes stages, wherein the degree to which the stages are bent is minimized by the presence of elastic members.

Abstract: A substrate bonding apparatus for fabricating an LCD device aligns upper and lower stages to accurately bond first and second substrates. The distance to which the upper and lower substrates are spaced apart from each other during bonding is adjustable depending on the determined thickness of the first and second substrates. Further, sealant material disposed on a substrate may be prevented from becoming contaminated by foreign material.

Abstract: A device for fabricating LCD devices includes a base frame, a lower chamber unit on the base frame, an upper chamber unit over the lower chamber unit and moveable over the base frame, chamber moving means for raising/lowering the upper chamber unit, stages within interior spaces of the upper and lower chamber units, wherein substrates are securable to each of the stages, and sealing means on at least one surface of the chamber units for sealing an interior space definable by joined upper and lower chamber units, the substrates being within the sealed interior space. A method for fabricating LCD devices includes loading substrates onto stages, lowering an upper chamber unit to seal an interior space from an external environment, evacuating the sealed interior space, aligning the first and second substrates, contacting the first and second substrates with sealant material, venting the sealed interior space, and unloading the bonded substrates.

Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

Abstract: A substrate bonding apparatus for manufacturing a liquid crystal display (LCD) device includes stages, wherein the degree to which the stages are bent is minimized by the presence of elastic members.

Abstract: A substrate bonding apparatus for fabricating an LCD device aligns upper and lower stages to accurately bond first and second substrates. The distance to which the upper and lower substrates are spaced apart from each other during bonding is adjustable depending on the determined thickness of the first and second substrates. Further, sealant material disposed on a substrate may be prevented from becoming contaminated by foreign material.

Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

Abstract: A device for fabricating LCD devices includes a base frame, a lower chamber unit on the base frame, an upper chamber unit over the lower chamber unit and moveable over the base frame, chamber moving means for raising/lowering the upper chamber unit, stages within interior spaces of the upper and lower chamber units, wherein substrates are securable to each of the stages, and sealing means on at least one surface of the chamber units for sealing an interior space definable by joined upper and lower chamber units, the substrates being within the sealed interior space. A method for fabricating LCD devices includes loading substrates onto stages, lowering an upper chamber unit to seal an interior space from an external environment, evacuating the sealed interior space, aligning the first and second substrates, contacting the first and second substrates with sealant material, venting the sealed interior space, and unloading the bonded substrates.