Patents by Inventor Young Kuk Ko
Young Kuk Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240298407Abstract: A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.Type: ApplicationFiled: October 17, 2023Publication date: September 5, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyumook Kim, Sanghoon Kim, Young Kuk Ko
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Publication number: 20240276643Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.Type: ApplicationFiled: April 23, 2024Publication date: August 15, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon KIM, Young Kuk KO, Gyu Mook KIM, Hea Sung KIM, Chi Won HWANG, Suk Chang HONG
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Publication number: 20240224436Abstract: A circuit board according to an embodiment includes: a first substrate; and an interposer board that is located on the first substrate, and includes a first insulating layer having a first surface and a second surface facing each other, a first wiring layer buried in the first surface of the first insulating layer, a second insulating layer located on the second surface of the first insulating layer, a cavity disposed in a part of the first insulating layer, and a first trench connected to the cavity; an electronic component disposed between the first substrate and the interposer board, and at least partially disposed in the cavity; and a molding layer located between the first substrate and the interposer board.Type: ApplicationFiled: August 17, 2023Publication date: July 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk Ko, Sanghoon Kim, Jiho Yoon, Gyumook Kim, Taehun Kim, Sukchang Hong, Seongil Jeon, Woo-Jeong Choi
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Publication number: 20240196535Abstract: A disclosed circuit board includes: an insulating layer; a contact layer disposed on a first surface of the insulating layer; a connecting layer including a connecting portion embedded in the insulating layer and disposed on the contact layer; a via penetrating the insulating layer and connected to the connecting layer; and a wiring layer disposed on a second surface of the insulating layer opposing the first surface and connected to the via. The connecting portion includes a first connecting layer portion disposed on the contact layer and a second connecting layer portion disposed on the first connecting layer portion. The insulating layer includes a first portion embedding the first connecting layer portion and surrounding the first connecting layer portion and a second portion embedding the second connecting layer portion. The insulating layer includes a cavity penetrating the second portion. The first portion has a smaller area than the second portion.Type: ApplicationFiled: October 20, 2023Publication date: June 13, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heasung Kim, Sanghoon Kim, Young Kuk Ko
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Patent number: 11997788Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.Type: GrantFiled: September 1, 2022Date of Patent: May 28, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
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Publication number: 20240170330Abstract: A substrate including: an insulation layer; a conductive layer disposed on the insulation layer; and a via hole configured to include a lower hole disposed in a first portion of the insulation layer and an upper hole disposed in a second portion of the insulating layer and connected to the lower hole, wherein a width of the upper hole is greater than that of the lower hole, at least a portion of the upper hole of the insulation layer has a width that is substantially equal to that of the upper hole of the conductive layer, and a first angle formed between a first direction that is parallel to a lower surface of the insulating layer and a sidewall of the lower hole and a second angle formed between the first direction and a sidewall of the upper hole are different from each other.Type: ApplicationFiled: June 7, 2023Publication date: May 23, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chanhoon Ko, Sanghoon Kim, Young Kuk Ko, Chulmin Lee, Inhwan Oh, Kyounghee Lim, Sohyun Bae
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Publication number: 20240130051Abstract: A printed circuit board: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via of the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via of the second insulation layer; and a cavity disposed in the first insulation layer and a portion of the second insulation layer. The cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths, the first portion is disposed at a lateral side of the first wiring layer, the second portion is disposed at a lateral side of the first via layer, and a first width of the first portion is greater than a second width of the second portion.Type: ApplicationFiled: May 30, 2023Publication date: April 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk Ko, Sanghoon Kim, Jiho Yoon, Gyumook Kim, Taehun Kim
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Publication number: 20240118028Abstract: An infrared heat source module is configured to minimize problems such as wrinkles or cracks in electrodes even if the patterns of a coated part and an uncoated part of the electrodes present in a current collector vary. The module improves a drying efficiency of the coated part of the current collector. An electrode using the infrared heat source module is manufactured by a process.Type: ApplicationFiled: January 27, 2022Publication date: April 11, 2024Applicant: LG Energy Solution, Ltd.Inventors: Soon Sik Choi, Young Kuk Ko, Oh Cheol Kwon, Ji Hwan Kim, Jeong Won Lee
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Publication number: 20230400253Abstract: An electrode drying system includes a drying oven configured to dry a solvent in an electrode active material slurry on an electrode sheet in which the electrode active material slurry is applied to a current collector, an air supply member configured to supply air to the drying oven, and a ventilation member configured to discharge air from the drying oven. At least part of the air discharged from the ventilation member is introduced into the air supply member again.Type: ApplicationFiled: July 26, 2022Publication date: December 14, 2023Applicant: LG Energy Solution, Ltd.Inventors: Young-Kuk Ko, Young-Gyu Moon, Shin-Wook Jeon, Sang-Hoon Choy, Soon-Sik Choi
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Publication number: 20230245989Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.Type: ApplicationFiled: April 7, 2023Publication date: August 3, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
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Publication number: 20230199956Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.Type: ApplicationFiled: May 10, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
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Publication number: 20230175776Abstract: A system for automatically controlling an electrode drying includes: an oven which provides a space where an electrode sheet is moved and dried, includes a dryer which applies hot air and/or radiant heat to the electrode sheet, and is divided into a plurality of drying sections; a measuring unit which collects information on a dried amount of the electrode sheet and transmits the collected information to a controller; and the controller which determines a dried level of the electrode sheet based on the information on the dried amount received from the measuring unit, and control a drying intensity of the oven according to the determined dried level. Herein, the controller independently controls the plurality of drying sections.Type: ApplicationFiled: November 17, 2021Publication date: June 8, 2023Applicant: LG Energy Solution, Ltd.Inventors: Jin Young Son, Sang Hoon Choy, Shin Wook Jeon, Eun Hoe Jeong, Young Kuk Ko
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Publication number: 20230171888Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.Type: ApplicationFiled: September 1, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon KIM, Young Kuk KO, Gyu Mook KIM, Hea Sung KIM, Chi Won HWANG, Suk Chang HONG
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Publication number: 20230147912Abstract: A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.Type: ApplicationFiled: March 10, 2022Publication date: May 11, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
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Publication number: 20230143349Abstract: A system for drying an electrode includes: an oven which applies hot air and radiant heat to an electrode sheet; and a controller which receives information on drying standby time, and controls an amount of heat supplied into the oven. Herein, the controller controls to supply a reduced amount of heat to the oven during an initial drying time right after the supply of the electrode sheet after the drying standby time.Type: ApplicationFiled: November 25, 2021Publication date: May 11, 2023Applicant: LG Energy Solution, Ltd.Inventors: Jin Young Son, Eun Hoe Jeong, Sang Hoon Choy, Shin Wook Jeon, Young Kuk Ko
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Publication number: 20230128999Abstract: A system for drying an electrode includes a drying unit which dries an electrode which is moving on a transfer line; a thermal imaging camera which photographs a surface of the electrode in real time; a calculation unit which stores an image taken by the thermal imaging camera, and generates temperature distribution data in a width direction of the electrode from the image; and an output unit which outputs the image and the temperature distribution data in a width direction of the electrode.Type: ApplicationFiled: November 17, 2021Publication date: April 27, 2023Applicant: LG Energy Solution, Ltd.Inventors: Eun Hoe Jeong, Sang Hoon Choy, Shin Wook Jeon, Oh Cheol Kwon, Jin Young Son, Young Kuk Ko
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Publication number: 20230117940Abstract: A printed circuit board includes: a first insulating layer having at least one recess portion in one surface thereof; a first wiring layer embedded in one surface of the first insulating layer; and a first via layer including a first via penetrating through at least a portion of the first insulating layer, one surface of the first via being exposed externally through the recess portion.Type: ApplicationFiled: September 6, 2022Publication date: April 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk KO, Chi Won HWANG, Sang Hoon KIM
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Publication number: 20230110084Abstract: A method and apparatus for coating an electrode is disclosed herein. In some embodiments, an apparatus for coating an electrode slurry includes a coating die configured to coat an electrode slurry on one surface of a current collector, a thickness measuring sensor spaced apart from the current collector by a predetermined interval and configured to measure a thickness of the coated electrode slurry in real time after coating by the coating die; and a controller which controls a coated amount of the electrode slurry in real time according to the measured thickness.Type: ApplicationFiled: November 4, 2021Publication date: April 13, 2023Applicant: LG Energy Solution, Ltd.Inventors: Jin Hwan Shin, Sang Hoon Choy, Shin Wook Jeon, Young Kuk Ko
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Publication number: 20220320027Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.Type: ApplicationFiled: February 28, 2022Publication date: October 6, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
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Patent number: 11297714Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.Type: GrantFiled: October 14, 2020Date of Patent: April 5, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Kuk Ko, Yoong Oh, Sang-Hoon Kim, Gyu-Mook Kim, Yong-Soon Jang, Hea-Sung Kim