Abstract: A printed circuit board: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via of the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via of the second insulation layer; and a cavity disposed in the first insulation layer and a portion of the second insulation layer. The cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths, the first portion is disposed at a lateral side of the first wiring layer, the second portion is disposed at a lateral side of the first via layer, and a first width of the first portion is greater than a second width of the second portion.

Abstract: An infrared heat source module is configured to minimize problems such as wrinkles or cracks in electrodes even if the patterns of a coated part and an uncoated part of the electrodes present in a current collector vary. The module improves a drying efficiency of the coated part of the current collector. An electrode using the infrared heat source module is manufactured by a process.

Abstract: An electrode drying system includes a drying oven configured to dry a solvent in an electrode active material slurry on an electrode sheet in which the electrode active material slurry is applied to a current collector, an air supply member configured to supply air to the drying oven, and a ventilation member configured to discharge air from the drying oven. At least part of the air discharged from the ventilation member is introduced into the air supply member again.

Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.

Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.

Abstract: A system for automatically controlling an electrode drying includes: an oven which provides a space where an electrode sheet is moved and dried, includes a dryer which applies hot air and/or radiant heat to the electrode sheet, and is divided into a plurality of drying sections; a measuring unit which collects information on a dried amount of the electrode sheet and transmits the collected information to a controller; and the controller which determines a dried level of the electrode sheet based on the information on the dried amount received from the measuring unit, and control a drying intensity of the oven according to the determined dried level. Herein, the controller independently controls the plurality of drying sections.

Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.

Abstract: A system for drying an electrode includes: an oven which applies hot air and radiant heat to an electrode sheet; and a controller which receives information on drying standby time, and controls an amount of heat supplied into the oven. Herein, the controller controls to supply a reduced amount of heat to the oven during an initial drying time right after the supply of the electrode sheet after the drying standby time.

Abstract: A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.

Abstract: A system for drying an electrode includes a drying unit which dries an electrode which is moving on a transfer line; a thermal imaging camera which photographs a surface of the electrode in real time; a calculation unit which stores an image taken by the thermal imaging camera, and generates temperature distribution data in a width direction of the electrode from the image; and an output unit which outputs the image and the temperature distribution data in a width direction of the electrode.

Abstract: A printed circuit board includes: a first insulating layer having at least one recess portion in one surface thereof; a first wiring layer embedded in one surface of the first insulating layer; and a first via layer including a first via penetrating through at least a portion of the first insulating layer, one surface of the first via being exposed externally through the recess portion.

Abstract: A method and apparatus for coating an electrode is disclosed herein. In some embodiments, an apparatus for coating an electrode slurry includes a coating die configured to coat an electrode slurry on one surface of a current collector, a thickness measuring sensor spaced apart from the current collector by a predetermined interval and configured to measure a thickness of the coated electrode slurry in real time after coating by the coating die; and a controller which controls a coated amount of the electrode slurry in real time according to the measured thickness.

Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A package substrate includes a wiring substrate comprising an insulating layer, a first wiring layer, and a second wiring layer, wherein the first wiring layer comprises a first pad pattern, and the second wiring layer comprises a second pad pattern; a first passivation layer disposed on the insulating layer, and having a first opening portion passing through a region corresponding to at least a portion of the first pad pattern; a second passivation layer disposed on the insulating layer, and having a second opening portion passing through a region corresponding to at least a portion of the second pad pattern; and a reinforcing layer disposed on the second passivation layer, and having a through portion exposing the second opening portion. An upper surface of the first wiring layer is located in a position higher than a position of the lower surface of the insulating layer.

Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

Abstract: A package substrate includes a wiring substrate comprising an insulating layer, a first wiring layer, and a second wiring layer, wherein the first wiring layer comprises a first pad pattern, and the second wiring layer comprises a second pad pattern; a first passivation layer disposed on the insulating layer, and having a first opening portion passing through a region corresponding to at least a portion of the first pad pattern; a second passivation layer disposed on the insulating layer, and having a second opening portion passing through a region corresponding to at least a portion of the second pad pattern; and a reinforcing layer disposed on the second passivation layer, and having a through portion exposing the second opening portion. An upper surface of the first wiring layer is located in a position higher than a position of the lower surface of the insulating layer.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Abstract: A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.