Abstract: An attenuator comprising a first thermal reservoir and a first metal layer located on top of the first thermal reservoir. A first dielectric layer located on top of the first metal layer and a resistor located on top the first dielectric layer. A second dielectric layer located on top of the resistor and a second metal layer located on top of the second dielectric layer. A second thermal reservoir located on top the third metal layer and wherein the resistor is split or perforated by a thermal shunt, wherein the thermal shunt includes a thermal column that directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: A method and device for crosstalk compensation includes evaluating skew for lengths of the two electrical paths. An integrated circuit is coupled to the two electrical paths, and the integrated circuit includes a global crosstalk compensation element integrated therewith which globally compensates for crosstalk on all lengths of portions of the two electrical paths.

Abstract: An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.

Abstract: A mapping system and method. The mapping system comprises an electromagnetic field generator, a layer of electromagnetic field absorbing material over an object, and an infrared camera. The electromagnetic field generator is adapted to generate an electromagnetic field and expose the electromagnetic field absorbing material and object to the electromagnetic field. The layer of electromagnetic field absorbing material is adapted to absorb the electromagnetic field and generate areas of thermal differences within the electromagnetic field absorbing material. The infrared camera is adapted to detect the areas of thermal differences.

Abstract: A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.

Abstract: The invention relates to an apparatus and method to determine contact dynamics between conductive surfaces, and more particularly to determine the dynamics of contact closure in mechanical switches and analysis of the dynamics of other mechanical systems, in general. A log amp is in electrical communication with the RF synthesizer via a transmission line. The log amp outputs a voltage converted from an envelope of an RF waveform to determine a capacitance between at least two conductive surfaces.

Abstract: A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.

Abstract: A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.

Abstract: An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.

Abstract: Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. The small auxiliary photodetector does not significantly affect the high speed performance of the transimpedance amplifier. The small auxiliary photodetector is provided to facilitate wafer-level testing at the transimpedance amplifier input. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.