Patents by Inventor Young Kwon Jeong

Young Kwon Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20210329794
    Abstract: A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Chan CHOI, Young Kwon JEONG, Min Soo KIM, Seong Jae MUN
  • Method for plating printed circuit board and printed circuit board using the same
    Patent number: 11096291
    Abstract: A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 17, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Chan Choi, Young Kwon Jeong, Min Soo Kim, Seong Jae Mun
  • METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20200413548
    Abstract: A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.
    Type: Application
    Filed: December 11, 2019
    Publication date: December 31, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Chan CHOI, Young Kwon JEONG, Min Soo KIM, Seong Jae MUN
  • Printed circuit board
    Patent number: 10827615
    Abstract: A printed circuit board includes a substrate having a first surface and a second surface, opposite to the first surface, and having a through-portion penetrating between the first surface and the second surface; and a through-via disposed in at least a portion of the through-portion, wherein the through-via includes a first metal layer having a first groove portion facing an interior of the through-portion from the first surface of the substrate and a second groove portion facing the interior of the through-portion from the second surface of the substrate, and the first metal layer has a first region, and a second region, having different average grain sizes.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Chan Choi, Young Kwon Jeong, Min Soo Kim, Seong Jae Mun