Abstract: An image correction apparatus includes an image correction processor configured to generate an image intensity gradient for each of areas of a pre-corrected image, generate a weight coefficient that is dependent on the image intensity gradient, generate a correction transfer function in which the weight coefficient is applied, generate an output value of a corrected image from an image intensity by applying the correction transfer function, and generate the corrected image based on the output value.

Abstract: A camera module, an electronic device and a method of operating the same are provided. The camera module includes a lens module including lenses, and a sensor module including an image sensor configured to sense an image input through the lens module and a logic unit configured to process the image from the image sensor and the logic unit stores a lens-customized point spread function pre-estimated to correct blur characteristics of the lenses within the lens module.

Abstract: An image correction apparatus includes an image correction processor configured to generate an image intensity gradient for each of areas of a pre-corrected image, generate a weight coefficient that is dependent on the image intensity gradient, generate a correction transfer function in which the weight coefficient is applied, generate an output value of a corrected image from an image intensity by applying the correction transfer function, and generate the corrected image based on the output value.

Abstract: A camera module, an electronic device and a method of operating the same are provided. The camera module includes a lens module including lenses, and a sensor module including an image sensor configured to sense an image input through the lens module and a logic unit configured to process the image from the image sensor and the logic unit stores a lens-customized point spread function pre-estimated to correct blur characteristics of the lenses within the lens module.

Abstract: An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.

Abstract: An acetabular cup assembly for an artificial hip joint includes an acetabular cup including a seating recess, a female taper formed on an inner wall, protrusion recesses formed to communicate with the seating recess and insertion recesses each positioned inside a corresponding one of the protrusion recesses; and a bearing including a male taper on an outer circumference thereof, protrusions inserted into the protrusion recesses, and insertion protruding portions each formed on a corresponding one of the protrusions, the insertion protruding portions being inserted into the insertion recesses. A polyethylene bearing can be firmly fixed to the acetabular cup. When a ceramic bearing made is inserted into the acetabular cup, the area where the bearing adjoins the acetabular cup is increased, thereby preventing the ceramic bearing from being broken. Since no groove is formed along the entire circumference of the acetabular cup, the strength is increased.

Abstract: An acetabular cup assembly for an artificial hip joint includes an acetabular cup including a seating recess, a female taper formed on an inner wall, protrusion recesses formed to communicate with the seating recess and insertion recesses each positioned inside a corresponding one of the protrusion recesses; and a bearing including a male taper on an outer circumference thereof, protrusions inserted into the protrusion recesses, and insertion protruding portions each formed on a corresponding one of the protrusions, the insertion protruding portions being inserted into the insertion recesses. A polyethylene bearing can be firmly fixed to the acetabular cup. When a ceramic bearing made is inserted into the acetabular cup, the area where the bearing adjoins the acetabular cup is increased, thereby preventing the ceramic bearing from being broken. Since no groove is formed along the entire circumference of the acetabular cup, the strength is increased.

Abstract: An epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device, the composition including an epoxy resin; a curing agent; a curing accelerator; an inorganic filler; and a flame retardant; wherein the flame retardant includes boehmite, and is present in an amount of about 0.1 to 20% by weight (wt %), based on a total weight of the epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.

Abstract: Provided are non-magnetic nickel powders and a method for preparing the same. The nickel powders are non-magnetic and have a HCP crystal structure. An exemplary method includes (a) dispersing nickel powders with a FCC crystal structure in an organic solvent to prepare a starting material dispersion, and (b) heating the starting material dispersion to transform the nickel powders with the FCC crystal structure to the nickel powders with the HCP crystal structure. The nickel powders do not exhibit magnetic agglomeration or aggregation phenomenon. Therefore, exemplary pastes for inner electrode formation in various electronic devices, which contain the nickel powders of the present disclosure, can be provided in a relatively uniform, well-dispersed state because of the reduced aggregation and agglomeration of the nickel powder. Also, inner electrodes made of the nickel powders can have a low impedance value even at high frequency band.

Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.

Abstract: A highly pure nitrogen trifluoride having a carbon tetrafluoride content of 10 ppm or less can be effectively obtained by boiling crude liquid nitrogen trifluoride having carbon tetrafluoride contaminant under a pressure ranging from 35 to 45 atm, to remove carbon tetrafluoride therefrom through vaporization.

Abstract: A highly pure nitrogen trifluoride having a carbon tetrafluoride content of 10 ppm or less can be effectively obtained by boiling crude liquid nitrogen trifluoride having carbon tetrafluoride contaminant under a pressure ranging from 35 to 45 atm, to remove carbon tetrafluoride therefrom through vaporization.

Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.