Abstract: The present invention discloses an address buffer and a semiconductor memory device having the address buffer. The address buffer comprises a first buffer for latching a signal in response to a first control signal in a normal operation mode in the semiconductor memory device and generating a buffered signal by buffering the latched signal in response to a second control signal, and a second buffer for maintaining a mode-setting signal in a reset status in the normal operation mode and for outputting the mode-setting signal by using the latched signal in response to the first control signal and a mode-setting command in a mode-setting operation mode. Accordingly, the mode-setting signal is generated only in the mode-setting operation mode, thereby reducing undesirable current consumption.

Abstract: A fabrication system for producing semiconductor devices having a clean room on two floors, a method of performing subsequent fabrication processes, a clean room, and a semiconductor wafer deliver system. The fabrication system includes first and second clean rooms on upper and lower floors respectively. Each of the first and second clean rooms includes a plurality of main bays that contain semiconductor fabrication apparatuses for performing semiconductor processes. A plurality of paths are positioned substantially perpendicular to the main bays and divide the main bays into a plurality of sub bays. Semiconductor wafer delivery systems may be located in the sub bays near the paths to transfer semiconductor wafers between the first and second clean rooms.

Abstract: A wafer space supporting apparatus is installed on a support chuck to relieve physical stress caused by thermal expansion or contraction of an object to be fabricated and adjusts itself to support the object to compensate for thermal expansion and contraction as well as minimize hard defects generated. The wafer space supporting apparatus includes a plurality of sliding pockets sunken into the supporting surface of the chuck, and sliding pads respectively floating-coupled in the sliding pockets such that they are spaced apart from the supporting surface so that they may adapt to expansions and contractions of an object to be fabricated, thereby preventing or minimizing any hard defects or physical stress.

Abstract: Disclosed is a soccer shoe having a structure, which allows a user to kick a ball farther, lessens the pain in a kicker's feet, and allows the shoe to maintain its shape after kicking a ball or even after being used for relatively long time. The soccer shoe has a sole member and an upper fixed to the sole member. The upper has: an inner coat fitly surrounding and being in contact with the heel, the inside foot, the outside foot, the toe, and the instep portions of the user, when the user puts on the soccer shoe, the inner coat being made from cloth; a sponge layer being adhered to an outer surface of the inner coat, the sponge layer being made from compressed sponge; a rubber layer being adhered to an outer surface of the sponge layer, the rubber layer being made from natural rubber, the rubber layer having a thickness between 0.38 mm and 0.

Abstract: In a PDP, an inductor is coupled to an electrode of a panel capacitor. A current of a first direction is injected to the inductor to store energy, and the voltage of the electrode is changed to Vs/2 using a resonance between the inductor and the panel capacitor and the stored energy. The difference between the Y electrode voltage Vs/2 and the X electrode voltage −Vs/2 causes a sustain on the panel. Subsequently, a current of a second direction, which is opposite to the first direction, is injected to the inductor to store energy therein. The voltage of the electrode is changed to −Vs/2 using a resonance between the inductor and the panel capacitor and the energy stored therein.

Abstract: A bulb in an electrodeless lamp system comprises: a bulb unit having an envelope space in which luminous material excited by electric field to form plasma and generate light is filled; and two or more conductors installed in the envelope space so that ends of the conductors face each other.

Abstract: A method for driving a plasma display panel, by alternately applying a first voltage and a second voltage to a panel capacitor formed between a first electrode and a second electrode. A first switch and a second switch coupled between a first terminal of the panel capacitor and a first power source for supplying the first voltage are turned off. A second voltage is applied to the first terminal of the panel capacitor. A first electric path between a contact of the first switch and the second switch, and a third voltage is formed. The third voltage being a voltage between the first voltage and the second voltage, where a first capacitor formed between both terminals of the first switch has a lower capacitance than a second capacitor formed between both terminals of the second switch.

Abstract: An anti-break cylindrical lever lock is provided. The lock comprises an outside lever having a key cylinder, a locking bar, an outer spindle, an inner spindle, a first protection part provided between the outside lever and the outer spindle, and a second protection part provided between the key cylinder and the inner spindle. When the lock is locked, the outer spindle and the inner spindle cannot be rotated and thus cannot make the locking bar retract. When the lock is locked and external force is exerted on the outside lever, the first protection part make the outside lever rotate idle separately from the outer spindle, and the second protection part make the key cylinder rotate idle separately from the inner spindle, thereby prevent the parts of the lock from being deformed or broken.

Abstract: In a PDP driver, first and second signal lines for a voltage of Vs and third and fourth signal lines for a voltage of 0V are formed. While maintaining Y and X electrodes of the panel capacitor at Vs and 0V, a first current path is formed from the first signal line to the fourth signal line through an inductor to supply a first-directional current to the inductor. A second current path is formed from the Y electrode to the X electrode through the inductor to change the Y and X electrode voltages using the resonance. When the electrode voltages become 0V and Vs, a third current path is formed from the third signal line to the second signal line through the inductor to reduce the first-directional current.

Abstract: A method and apparatus for reducing false contour in a digital display apparatus including a plasma display panel (PDP) using pulse number modulation are provided.

Abstract: The present invention relates to high efficiency welding electrodes, and more particularly, to an improvement in section structure of a wire rod for a fusion welding in which the section of the wire rod has a polygonal shape or is formed with a multiple of grooves in the longitudinal direction of the wire rod. Thereby, the sectional area of the wire rod becomes decreased and the surface area of the wire rod becomes increased. Therefore, a welding efficiency is highly improved.

Abstract: Disclosed-herein is a highly weather resistant colored steel plate which comprises a steel plate as a substrate, a zinc- or zinc alloy-plated layer formed on the steel plate, a layer formed on the zinc- or zinc alloy-plated layer and pretreated with chromate or non-chromate, and a highly weather resistant film formed on the chromate or non-chromate layer, wherein the highly weather resistant film includes a polyester-based primer coated onto the chromate or non-chromate layer and a polyester top coat coated onto the polyester-based primer, the top coat being produced from a mixture of a main resin obtained by reacting an oil-free polyester-modified resin and a polyisocyanate compound, a melamine resin as a crosslinking agent, and other additives.

Abstract: A positive active material of a lithium-sulfur battery includes a sulfur-conductive agent-agglomerated complex in which a conductive agent particle is attached onto a surface of a sulfur particle having an average particle size less than or equal to 7 &mgr;m. The sulfur-conductive agent-agglomerated complex is manufactured by mixing a sulfur powder and a conductive agent powder to form a mixture, and milling the mixture.

Abstract: A multimedia broadcast/multicast service (MBMS) in a universal mobile telecommunications system (UMTS) includes a UTRAN that provides an MBMS service. The MBMS service-related information is exchanged between the UTRAN and a terminal or between nodes in the UTRAN by using an MBMS identification so that a user group receiving MBMS data or a data of a specific MBMS service can be identified.

Abstract: The present invention relates to a method for reforming the surface of polymer, especially to a method for providing hydrophilicity or increasing hydrophobicity by reforming the surface of polymer or polymer membrane. The present invention is a method for reforming the surface of polymer membrane by irradiating it with energized ionic particles under the vacuum condition. The method including the steps of: a) manufacturing polymer membrane, including a surface activated, by inserting polymer membrane into a vacuum chamber, and by irradiating energized ionic particles on the surface of polymer membrane with an ion beam under a high vacuum; and b) manufacturing polymer membrane treated with a reactive gas on the surface of membrane, including the activated surface of step a), by infusing the reactive gas into a vacuum chamber after energized ionic particles of step a) have been irradiated.

Abstract: A solder-fill used for mounting a semiconductor chip consists of under-fill material to fill the gap between the semiconductor chip and the PCB, and the solder bump material formed by a plurality of dot or disc shapes and disposed interior of the under-fill material with same thickness to match with the connection pattern of semiconductor chip pad and the PCB. A process of manufacturing the solder-fill is that of: arranging a plurality of wire or rod shaped solder bump material to match with the connection pattern of semiconductor chip and PCB in a container, filling a liquid state of under-fill material into the container, solidifying the under-fill material in the container, and slicing the solidified under-fill material and solder bump material with a uniform thickness.

Abstract: A joint detection reception apparatus and method, which are utilized irrespective of a length of an orthogonal code in a TD-CDMA communication system.

Abstract: An apparatus and a method for testing a socket are disclosed. The resistance values of the contactor pins of the socket can be precisely measured, and the measurement is made automatic so as to decrease the expense and manpower. The method includes the following steps. That is, a calibration PCB is formed into a closed circuit, and all the resistance values forming a closed circuit loop for respective channels are extracted and stored (first step). A socket-installed PCB is formed into a closed circuit, and all resistance values forming a closed circuit loop for respective channels are extracted and stored (second step). Differences between the resistance values of the respective channels of the calibration PCB and the resistance values of the respective channels of the socket-installed PCB are calculated (third step). The differences thus calculated are displayed to a screen for the respective channels (fourth step).

Abstract: An idler device of the magnetic recording/reproducing apparatus is disclosed having the construction that an idler arm is inserted to the side of a clutch shaft which is installed at a lower surface of a main chassis. Without an extra construction for the assembly, a snap engagement is possibly made, so that a workability of an assembly working is improved and the number of parts can be reduced, and thus, a production cost can be reduced. In addition, the assembly of an idler gear is completed as a plate spring is fixed to an idler shaft in a state that the idler gear is inserted in the idler shaft of an idler arm. Thus, the assembly working is relatively facilitated, and a production cost can be reduced with the simple construction. Moreover, since the plate spring is installed in a state of being fixed at the protrusion bar by the stopper, the relative position of the plate spring is precisely set with respect to the neighboring parts, so that an operation reliability can be remarkably improved.

Abstract: A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.