Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

Abstract: An inductor includes a support member; a coil including a plurality of coil patterns disposed on one surface or the other surface of the support member, an insulating layer surrounding the coil, and an encapsulant encapsulating the support member and the coil patterns. At least portions of the insulating layer may be disposed to be recessed from the one surface or the other surface of the support member toward a center of the support member.

Abstract: An inductor includes a body including a support member, a coil, and an encapsulant, and external electrodes on external surfaces of the body. The coil in the body may be formed so that a plurality of coil patterns are continuously formed, wherein the coil pattern includes first and second coil layers, and the encapsulant extends downward between adjacent coil patterns to be between first coil layers of adjacent coil patterns.

Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.

Abstract: An inductor includes a support member; a coil including a plurality of coil patterns disposed on one surface or the other surface of the support member, an insulating layer surrounding the coil, and an encapsulant encapsulating the support member and the coil patterns. At least portions of the insulating layer may be disposed to be recessed from the one surface or the other surface of the support member toward a center of the support member.

Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.

Abstract: An inductor includes a body including a support member, a coil, and an encapsulant, and external electrodes on external surfaces of the body. The coil in the body may be formed so that a plurality of coil patterns are continuously formed, wherein the coil pattern includes first and second coil layers, and the encapsulant extends downward between adjacent coil patterns to be between first coil layers of adjacent coil patterns.