Abstract: A separator for an electrochemical device of the present disclosure includes: a porous polymer substrate; and a coating layer provided on at least one surface of the porous polymer substrate, and including inorganic particles, a polymer binder, and a dispersant. The coating layer is manufactured by a coating layer composition, the coating layer composition includes inorganic particles, a polymer binder, and a dispersant, and the dispersant includes a maleic acid monomer.

Abstract: A package for semiconductor is disclosed. The semiconductor package according to an aspect of the present invention may include a semiconductor chip; a first insulating layer for embedding the semiconductor chip and protecting the semiconductor chip; a redistribution layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and for embedding the redistribution layer and protecting the redistribution layer; and a conductive pad disposed on the second insulating layer.

Abstract: A semiconductor package and manufacturing method is disclosed. The semiconductor package includes a semiconductor chip having a plurality of chip terminals formed on one surface thereof, a redistribution layer electrically connected to the chip terminal and extending outwardly from a side surface of the chip to electrically connect the chip terminal to an external device, an external pad provided on the insulating layer, formed to be in contact with the redistribution layer exposed from the insulating layer to be electrically connected to the redistribution layer, and exposed to an upper side of the insulating layer; an external connection terminal formed on the external pad and contacting an external device, a protective layer formed to surround at least one surface and a side surface of the chip, and an insulating layer formed to cover the redistribution layer.

Abstract: The present invention relates to a method of manufacturing a hyaluronate film and a hyaluronate film manufactured thereby, and more particularly to a method of manufacturing a hyaluronate film through a solvent-casting process or using an automatic film applicator that facilitates mass production and to a hyaluronate film manufactured thereby, which is useful as a mask pack for cosmetics, a patch for medicaments and medical devices, a film-type adhesion inhibitor, etc. Unlike conventional liquid products, the hyaluronate film according to the present invention has a dry surface and thus entails no concern about microbial contamination, is easy to produce/manage/distribute/use, and has superior mechanical properties, whereby it can be utilized for various applications such as packs, patches, artificial skin and the like for cosmetics, medicaments, and medical devices.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad on a first surface thereof, an external pad electrically connected to the chip pad of the semiconductor chip, an external connection terminal covering the external pad, and an intermediate layer between the external pad and the external connection terminal, the intermediate layer including a third metal material that is different from a first metal material included in the external pad and a second metal material included in the external connection terminal.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad on a first surface thereof, an external pad electrically connected to the chip pad of the semiconductor chip, an external connection terminal covering the external pad, and an intermediate layer between the external pad and the external connection terminal, the intermediate layer including a third metal material that is different from a first metal material included in the external pad and a second metal material included in the external connection terminal.

Abstract: The present invention relates to a method of manufacturing a hyaluronate film and a hyaluronate film manufactured thereby, and more particularly to a method of manufacturing a hyaluronate film through a solvent-casting process or using an automatic film applicator that facilitates mass production and to a hyaluronate film manufactured thereby, which is useful as a mask pack for cosmetics, a patch for medicaments and medical devices, a film-type adhesion inhibitor, etc. Unlike conventional liquid products, the hyaluronate film according to the present invention has a dry surface and thus entails no concern about microbial contamination, is easy to produce/manage/distribute/use, and has superior mechanical properties, whereby it can be utilized for various applications such as packs, patches, artificial skin and the like for cosmetics, medicaments, and medical devices.

Abstract: A polyamide/hybrid carbon filler composite is disclosed. The composite includes a polyamide as a matrix and a hybrid carbon filler dispersed in and bonded to the polyamide matrix. The hybrid carbon filler is composed of a nano carbon and a carbon fiber. Also disclosed is a method for preparing the polyamide/hybrid carbon filler. The method includes simultaneously subjecting a mixture of a polyamide and a hybrid carbon filler to mechanofusion and plasma treatments.

Abstract: A polyamide/hybrid carbon filler composite is disclosed. The composite includes a polyamide as a matrix and a hybrid carbon filler dispersed in and bonded to the polyamide matrix. The hybrid carbon filler is composed of a nano carbon and a carbon fiber. Also disclosed is a method for preparing the polyamide/hybrid carbon filler. The method includes simultaneously subjecting a mixture of a polyamide and a hybrid carbon filler to mechanofusion and plasma treatments.

Abstract: A blank mask includes a substrate having a first surface and a second surface which are opposite to each other. The substrate includes a trench having a predetermined depth from the second surface. A reflection layer is disposed on the first surface of the substrate to reflect extreme ultraviolet (EUV) rays. An absorption layer is disposed on the reflection layer opposite to the substrate to absorb EUV rays. A conductive layer is disposed in the trench to expose portions of the substrate. The conductive layer includes first conductive lines and second conductive lines intersecting the first conductive lines, and the exposed portions of the substrate are two dimensionally arrayed to have island shapes.

Abstract: A blank mask includes a substrate having a first surface and a second surface which are opposite to each other. The substrate includes a trench having a predetermined depth from the second surface. A reflection layer is disposed on the first surface of the substrate to reflect extreme ultraviolet (EUV) rays. An absorption layer is disposed on the reflection layer opposite to the substrate to absorb EUV rays. A conductive layer is disposed in the trench to expose portions of the substrate. The conductive layer includes first conductive lines and second conductive lines intersecting the first conductive lines, and the exposed portions of the substrate are two dimensionally arrayed to have island shapes.

Abstract: Blank masks for extreme ultraviolet (EUV) photolithography are provided. The blank mask includes a substrate having a first surface and a second surface which are opposite to each other, a reflection layer disposed on the first surface of the substrate to reflect extreme ultraviolet (EUV) rays, an absorption layer disposed on the reflection layer opposite to the substrate to absorb extreme ultraviolet (EUV) rays, and a conductive layer disposed on the second surface of the substrate to expose portions of the substrate. Related methods are also provided.

Abstract: Blank masks for extreme ultraviolet (EUV) photolithography are provided. The blank mask includes a substrate having a first surface and a second surface which are opposite to each other, a reflection layer disposed on the first surface of the substrate to reflect extreme ultraviolet (EUV) rays, an absorption layer disposed on the reflection layer opposite to the substrate to absorb extreme ultraviolet (EUV) rays, and a conductive layer disposed on the second surface of the substrate to expose portions of the substrate. Related methods are also provided.

Abstract: The present invention comprises an improved method of forming the source voltage lines, connection lines, and high load resistors for use in HLR SRAM devices. The source voltage lines, connection lines, and high load resistors are formed from a single polysilicon film that is selectively silicided to produce the low resistance structures while preserving the as-deposited polysilicon resistivity for formation of the high load resistor. The improved resistance control allows reduced feature size and increased pattern density.