Patents by Inventor Young-mun CHO

Young-mun CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10568606
    Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: February 25, 2020
    Assignee: Samsung Medison Co., Ltd.
    Inventors: Jin Ho Gu, Jae-Yk Kim, Jong Mok Lee, Young Mun Cho
  • Publication number: 20190167230
    Abstract: There is disclosed an ultrasonic probe, and more particularly, an ultrasonic probe configured to visually provide a change based on an ultraviolet (UV) response during UV disinfection. The ultrasonic probe according to one aspect of the present disclosure is provided such that a coated layer formed of a UV-sensitive material is provided on a surface of the ultrasonic probe, and the UV-sensitive material provided in the coated layer is discolored.
    Type: Application
    Filed: January 11, 2018
    Publication date: June 6, 2019
    Inventors: Young Mun CHO, Kyung Hun SONG
  • Publication number: 20160151043
    Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.
    Type: Application
    Filed: December 1, 2015
    Publication date: June 2, 2016
    Inventors: Jin Ho GU, Jae-Yk KIM, Jong Mok LEE, Young Mun CHO
  • Publication number: 20150297181
    Abstract: An ultrasound probe includes a transducer which generates ultrasound waves; an acoustic lens which focuses the ultrasound waves; a lens coating layer formed on at least a portion of an outer surface of the acoustic lens by mixing polymer particles with nanoparticles; and a housing which accommodates the transducer.
    Type: Application
    Filed: March 23, 2015
    Publication date: October 22, 2015
    Inventors: Saidmurod AKRAMOV, Won-hee LEE, Young-mun CHO