Abstract: A semiconductor device and method of forming a pad thereof are provided. The device includes: a substrate; at least one first active region disposed in a first region of the substrate; at least one second active region disposed in a second region adjacent to the first region of the substrate; a plurality of first contacts disposed on the second active region; a first insulating layer disposed on the first active region and between the first contacts; a poly layer disposed on the first contacts and the first insulating layer; a plurality of second contacts disposed on the poly layer in the second region; a second insulating layer disposed between the second contacts and on the poly layer in the first region; and a pad disposed on the second insulating layer and the second contacts.

Abstract: A semiconductor memory device has a layout that minimizes the area required for sense amplifier and word line driver regions. In the semiconductor memory device of the present invention, decoding drivers are arranged in sense amplifier regions. Further, the wiring for signals to be transmitted from decoding drivers to a corresponding sub-word line driver is arranged in adjacent sub-arrays. Accordingly, the area of word line regions can be remarkably reduced. Further, the wiring required to transmit pre-decoding signals that are provided to decoding drivers is also arranged in adjacent sub-arrays. Accordingly, the area of sense amplifier regions can be greatly reduced. Consequently, the semiconductor memory device of the present invention is advantageous in that the layout area thereof is notably reduced.

Abstract: Example embodiments are directed to a semiconductor memory device that may include a plurality of memory cells, each having a transistor of a first conductivity type with a first shape, a sub-word line driver including a transistor of the first conductivity type with a second shape and a transistor of a second conductivity type with the second shape, a sense amplifier including a transistor of the first conductivity type with the second shape and a transistor of the second conductivity type with the second shape, and a peripheral circuit including a transistor of the first conductivity type with the second shape and a transistor of the second conductivity type with the second shape in order to control inputting/outputting of data to/from the memory cells.

Abstract: A semiconductor memory device has a layout that minimizes the area required for sense amplifier and word line driver regions. In the semiconductor memory device of the present invention, decoding drivers are arranged in sense amplifier regions. Further, the wiring for signals to be transmitted from decoding drivers to a corresponding sub-word line driver is arranged in adjacent sub-arrays. Accordingly, the area of word line regions can be remarkably reduced. Further, the wiring required to transmit pre-decoding signals that are provided to decoding drivers is also arranged in adjacent sub-arrays. Accordingly, the area of sense amplifier regions can be greatly reduced. Consequently, the semiconductor memory device of the present invention is advantageous in that the layout area thereof is notably reduced.

Abstract: A semiconductor chip package may include a circuit board and a semiconductor chip that may be attached to the circuit board so as to be electrically connected to the circuit board. An intermediate pattern for reducing stress may be provided on a surface of the semiconductor chip that may face the circuit board.

Abstract: A semiconductor device and method of forming a pad thereof are provided. The device includes: a substrate; at least one first active region disposed in a first region of the substrate; at least one second active region disposed in a second region adjacent to the first region of the substrate; a plurality of first contacts disposed on the second active region; a first insulating layer disposed on the first active region and between the first contacts; a poly layer disposed on the first contacts and the first insulating layer; a plurality of second contacts disposed on the poly layer in the second region; a second insulating layer disposed between the second contacts and on the poly layer in the first region; and a pad disposed on the second insulating layer and the second contacts.

Abstract: Integrated circuit memory devices include first and second memory cell arrays, first and second transmission parts between the first and second memory cell arrays, and first and second input/output selection parts between the first and second memory cell arrays, wherein the first transmission part is adjacent the first input/output selection part and wherein the second transmission part is adjacent the second input/output selection part. A transistor in the first transmission part and a transistor in the first input/output selection part can share a first common source/drain region. A transistor in the second transmission part and a transistor in the second input/output selection part also can share a second common source/drain region. First and second input/output selection parts also may be provided between the first and second transmission parts. At least one sense amplifier part may be provided between the first and second input/output selection parts.