Patents by Inventor Young Pil KWON

Young Pil KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Porous polyurethane polishing pad and preparation method thereof
    Patent number: 11724356
    Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: August 15, 2023
    Assignee: SK enpulse Co., Ltd.
    Inventors: Jang Won Seo, Hyuk Hee Han, Hye Young Heo, Joonsung Ryou, Young Pil Kwon
  • Porous polyurethane polishing pad and process for preparing the same
    Patent number: 11642752
    Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: May 9, 2023
    Assignee: SK ENPULSE CO., LTD.
    Inventors: Jang Won Seo, Hyuk Hee Han, Hye Young Heo, Joonsung Ryou, Young Pil Kwon
  • POROUS POLYURETHANE POLISHING PAD AND PROCESS FOR PREPARING THE SAME
    Publication number: 20210229237
    Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.
    Type: Application
    Filed: September 10, 2018
    Publication date: July 29, 2021
    Inventors: Jang Won SEO, Hyuk Hee HAN, Hye Young HEO, Joonsung RYOU, Young Pil KWON
  • POROUS POLYURETHANE POLISHING PAD AND PREPARATION METHOD THEREOF
    Publication number: 20190061097
    Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.
    Type: Application
    Filed: August 22, 2018
    Publication date: February 28, 2019
    Inventors: Jang Won SEO, Hyuk Hee HAN, Hye Young HEO, Joonsung RYOU, Young Pil KWON