Abstract: According to a main objective of the present invention, the three-dimensional arrangement of solar cells is adjusted so as to use sunlight directly coming from the sun mainly for solar power generation while transmitting wavelengths necessary for the growth of plants and reflecting wavelengths unnecessary for or hindering the growth of plants among wavelengths of sunlight passing through the solar cells to use the reflected wavelengths for additional solar power generation. Sunlight reflected by the dichroic optical filter may be used to additionally generate electricity using solar cells provided perpendicular to the dichroic optical filter, thereby maximizing the use efficiency of sunlight.

Abstract: The present disclosure relates to a full-color light-emitting diode (LED) display, and more particularly, to a full-color LED display using an ultra-thin LED element and a manufacturing method thereof.

Abstract: A light emitting device may include a substrate. A light emitting element layer may be disposed on the substrate and may include light emitting elements having a rod shape. A color conversion layer may be disposed on the light emitting element layer and may include color conversion elements having a rod shape. A first alignment direction of the light emitting elements and a second alignment direction of the color conversion elements may be substantially parallel to each other or intersect at a predetermined angle.

Abstract: Provided are a light emitting element and a display device comprising same. The light emitting element comprises: a first conductivity type semiconductor doped with a dopant having a first polarity, a second conductivity type semiconductor doped with a dopant having a second polarity opposite to the first polarity; an active layer between the first conductivity type semiconductor and the second conductivity type semiconductor; and an insulation film which surrounds at least a side surface of the active layer, wherein the insulation film includes an insulation coating film and at least one light conversion particle on at least a portion of the insulation coating film.

Abstract: A light emitting device may include a substrate. A light emitting element layer may be disposed on the substrate and may include light emitting elements having a rod shape. A color conversion layer may be disposed on the light emitting element layer and may include color conversion elements having a rod shape. A first alignment direction of the light emitting elements and a second alignment direction of the color conversion elements may be substantially parallel to each other or intersect at a predetermined angle.

Abstract: The present disclosure relates to a method of separating a plurality of light-emitting diode (LED) structures from a wafer. According to the method, the LED structures each having a desired size, thickness, and shape can be separated from the wafer, using a commercialized wafer, without damage to the LED structures even without considering the presence or absence of a sacrificial layer and specifically pre-designing a thickness of semiconductor layers in the wafer from the time of wafer manufacturing.

Abstract: A display device includes a first electrode disposed on a substrate, a second electrode disposed on the substrate, and spaced apart from and facing the first electrode, at least one light emitting element disposed between the first electrode and the second electrode, a first conductive contact pattern disposed on the first electrode and electrically contacting the first electrode and an end of the at least one light emitting element, and a second conductive contact pattern disposed on the second electrode and electrically contacting the second electrode and another end of the at least one light emitting element.

Abstract: A light emitting device includes a substrate. First and second electrodes are on the substrate and spaced from each other. A first insulating layer is on the substrate and the first and second electrodes, and includes openings to partially expose opposing portions of the first and second electrodes adjacent an area between the first and second electrodes. At least one light emitting element is located in the opening. A first end of the at least one light emitting element is connected to a first portion of the first electrode exposed by the opening, and a second end of the at least one light emitting element is connected to a second portion of the second electrode exposed by the opening.

Abstract: Provided is a method of manufacturing a nanorod. The method comprising comprises the steps of: providing a growth substrate and a support substrate; epitaxially growing a nanomaterial layer onto one surface of the growth substrate; forming a sacrificial layer on one surface of the support substrate; bonding the nanomaterial layer with the sacrificial layer; separating the growth substrate from the nanomaterial layer; flattening the nanomaterial layer; forming a nanorod by etching the nanomaterial layer; and separating the nanorod by removing the sacrificial layer.

Abstract: The present invention relates to a light emitting diode (LED) electrode assembly, and more particularly, to an ultra-thin fine LED electrode assembly, a method of manufacturing the same, and a light source including the same. Accordingly, as a surface of the ultra-thin fin LED element, which is in contact with an electrode, is a surface rather than a side surface through dielectrophoresis, drivable mounting efficiency increases, and at the same time, one specific surface is in selective contact with a mounting electrode, and thus a range of selection for driving power may be expanded to include a direct current (DC) power. Therefore, an LED electrode assembly having higher brightness is achieved advantageously.

Abstract: Disclosed herein are a light-emitting diode (LED) device, and an ink composition including the same, which can reduce an exposed area of a photoactive layer exposed at a surface to prevent a decrease in efficiency due to a surface defect, and repair the surface defect and minimize degradation in light emission efficiency due to the surface defect even when the surface defect occurs to maintain high efficiency in light extraction efficiency and, simultaneously, minimize a side surface contact through a mounting method using dielectrophoresis when LED devices are self-aligned on a mounting electrode to improve a drivable (or light emittable) mounting efficiency.

Abstract: The present invention relates to a transparent ultra-thin LED display. According to the present invention, it is advantageous to achieve a transparent ultra-thin LED display that has excellent transparency and excellent luminance characteristics, thereby minimizing the impact on contrast ratio and visibility depending on the illuminance of external light in the usage environment.

Abstract: A pixel structure and driving method of an ultra-thin device display with alignment and driving electrode switching functions.

Abstract: A light emitting device, a display device including a light emitting device, and a method of manufacturing a display device are provided. A light emitting device may include a substrate, and a plurality of light emitting element layers stacked on the substrate. Each of the light emitting element layers may include an insulating layer entirely disposed on the substrate, a first electrode and a second electrode disposed on the insulating layer and spaced apart from each other, and a plurality of light emitting elements disposed between the first electrode and the second electrode.

Abstract: A light emitting device may include first electrodes and second electrodes that are spaced apart from each other in a first direction, light emitting elements electrically connected between adjacent first and second electrodes among the first and the second electrodes, and a third electrode spaced apart from the first electrodes and the second electrodes. The third electrode may be electrically separated from the first electrodes and the second electrodes.

Abstract: The present invention relates to an LED electrode assembly, more particularly, to a micro-nanofin LED electrode assembly, a method for manufacturing the same, and a light source including the same.

Abstract: The present invention relates to an LED electrode assembly, and more particularly, to an ultra-thin pin LED electrode assembly, a manufacturing method thereof, and a light source including the same. According to the present invention, the surface of the ultra-thin pin LED device in contact with the electrode through dielectrophoresis becomes a surface rather than a side surface, thereby increasing the drivable mounting efficiency. Further, by allowing a specific surface to selectively contact the mounting electrode, the range of driving power selection can be extended to DC power. Accordingly, it is advantageous to achieve a higher luminance LED electrode assembly.

Abstract: The present invention relates to a full-color LED display. According to the present invention, a surface of an ultra-thin pin LED device in contact with an electrode through dielectrophoresis becomes a surface rather than a side surface, thereby increasing a drivable mounting efficiency, which is advantageous for achieving a higher luminance full-color LED display.

Abstract: An ultra-small light-emitting diode (LED) electrode assembly having an improved luminance is provided. More particularly, an ultra-small LED electrode assembly in which light, which is blocked by an electrode and cannot be extracted, is minimized, an ultra-small LED device is connected to an ultra-small electrode without a defect such as an electrical short-circuit, and a very excellent luminance is exhibited even at a direct current (DC) driving voltage, and a method of manufacturing the same are provided.

Abstract: The present invention relates to an LED device, and more particularly, to an ultra-thin pin LED device and an ink composition including the same. According to the present invention, it is advantageous to achieve higher luminance and light efficiency by increasing the emission area and preventing or minimizing the reduction in efficiency due to surface defects. In addition, it is very suitable for a dielectrophoretic method of self-aligning the devices on electrodes by electric field, and the drivable mounting efficiency can be increased by ensuring that the surface in contact with the electrodes is a surface other than the side surfaces.