Patents by Inventor Young-rok Oh

Young-rok Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210022249
    Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 21, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byung-guk SEO, Sun-ki YUN, Su-jin KIM, Hwi-jong YOO, Young-rok OH
  • Patent number: 10890796
    Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: January 12, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki Taek Lee, Hae Jung Yang, Hee Youb Kang, Young Rok Oh, Hee Chul Lee
  • Patent number: 10840221
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
  • Publication number: 20200341049
    Abstract: Provided are a device and a method for monitoring substrates to determine a processed state of the substrates and inspecting presence of abnormality in the processed substrates. A device for inspecting substrates includes a substrate mounting part moving relative to the substrate and for mounting a substrate, a measurement part for monitoring the substrate, a control part configured to control a movement path of the measurement part so that at least some regions are monitored from positions different from each other with respect to a plurality of substrates, and an analysis part configured to determine presence of abnormality from monitoring information about the plurality of substrates.
    Type: Application
    Filed: December 27, 2018
    Publication date: October 29, 2020
    Inventors: Gu Hyun JUNG, Young Rok KIM, Se Yong OH, Chul Joo HWANG, Jin An JUNG
  • Patent number: 10820419
    Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: October 27, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-guk Seo, Sun-ki Yun, Su-jin Kim, Hwi-jong Yoo, Young-rok Oh
  • Publication number: 20200241335
    Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.
    Type: Application
    Filed: June 14, 2019
    Publication date: July 30, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ki Taek LEE, Hae Jung YANG, Hee Youb KANG, Young Rok OH, Hee Chul LEE
  • Publication number: 20200218309
    Abstract: A display device includes a display panel including a display surface in which an active area configured to display an image and a peripheral area disposed adjacent to the active area are defined, a light source configured to provide a light to the display panel, an optical member disposed between the light source and the display panel, a light blocking layer covering a side surface of the optical member, a support member supporting the optical member, and an intermediate protective member disposed between the display panel and the light source to support the display panel. The support member is supported by the intermediate protective member.
    Type: Application
    Filed: December 2, 2019
    Publication date: July 9, 2020
    Inventors: Young-Rok OH, Minsu JUNG, MANSOO KIM, BYUNG JIN PARK
  • Publication number: 20200176423
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Inventors: ILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
  • Patent number: 10593648
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: March 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
  • Patent number: 10529692
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: January 7, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
  • Publication number: 20190373730
    Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.
    Type: Application
    Filed: December 3, 2018
    Publication date: December 5, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byung-guk SEO, Sun-ki YUN, Su-jin KIM, Hwi-jong YOO, Young-rok OH
  • Publication number: 20180323175
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Application
    Filed: July 2, 2018
    Publication date: November 8, 2018
    Inventors: ILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
  • Patent number: 10068828
    Abstract: A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: September 4, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Young Choi, Young-Rok Oh, Hwi-Jong Yoo, Il-Soo Kim, Joo-Young Kim, Ki-Taek Lee, Eun-Ji Yu
  • Publication number: 20180158492
    Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.
    Type: Application
    Filed: June 19, 2017
    Publication date: June 7, 2018
    Inventors: Sangsu LEE, Yusuf CINAR, Nam-Hoon KIM, Heeyoub KANG, Young-Rok OH
  • Publication number: 20180158752
    Abstract: A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.
    Type: Application
    Filed: April 4, 2017
    Publication date: June 7, 2018
    Inventors: MIN-YOUNG CHOI, YOUNG-ROK OH, HWI-JONG YOO, IL-SOO KIM, JOO-YOUNG KIM, KI-TAEK LEE, EUN-JI YU
  • Patent number: 9990964
    Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: June 5, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangsu Lee, Yusuf Cinar, Nam-Hoon Kim, Heeyoub Kang, Young-Rok Oh
  • Publication number: 20180138154
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Application
    Filed: November 14, 2017
    Publication date: May 17, 2018
    Inventors: ILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
  • Patent number: 9140840
    Abstract: Exemplary embodiments of the present invention relate to a backlight assembly and a display device, including a backlight unit including a light emitting diode (LED) light source of and a light guide, and a bottom chassis disposed at a rear surface of the backlight unit, wherein the bottom chassis includes a bottom chassis main body, an inner supporting member disposed at an inner surface of the bottom chassis main body, an outer supporting member disposed at an outer surface of the bottom chassis main body, and a fastener to fasten at least two of the bottom chassis main body, the inner supporting member, and the outer supporting member.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: September 22, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Woo Jang, Young-Rok Oh
  • Publication number: 20140204610
    Abstract: Exemplary embodiments of the present invention relate to a backlight assembly and a display device, including a backlight unit including a light emitting diode (LED) light source of and a light guide, and a bottom chassis disposed at a rear surface of the backlight unit, wherein the bottom chassis includes a bottom chassis main body, an inner supporting member disposed at an inner surface of the bottom chassis main body, an outer supporting member disposed at an outer surface of the bottom chassis main body, and a fastener to fasten at least two of the bottom chassis main body, the inner supporting member, and the outer supporting member.
    Type: Application
    Filed: June 4, 2013
    Publication date: July 24, 2014
    Inventors: Jae-Woo JANG, Young-Rok OH
  • Patent number: 8325291
    Abstract: A display device capable of minimizing the width of a bezel is presented. The display device includes a display panel displaying an image; a first frame having a first surface configured to support the display panel and a second surface on which a first coupling mechanism is formed; a second frame having a second coupling mechanism and engaged with the first frame; an optical member interposed between the first frame and the second frame; a receptacle including four side-wall parts and a bezel part extended from the side-wall parts to an inside thereof, and receiving the display panel, the first frame, and the second frame therein, wherein the first coupling mechanism and the second coupling mechanism comprise a first fixing projections and a first fixing holes into which the first fixing projections are inserted.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: December 4, 2012
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young-Rok Oh, Won-Seok Kim