Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.

Abstract: A display device includes a display panel including a display surface in which an active area configured to display an image and a peripheral area disposed adjacent to the active area are defined, a light source configured to provide a light to the display panel, an optical member disposed between the light source and the display panel, a light blocking layer covering a side surface of the optical member, a support member supporting the optical member, and an intermediate protective member disposed between the display panel and the light source to support the display panel. The support member is supported by the intermediate protective member.

Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.

Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.

Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.

Abstract: A display device includes a display panel including a display surface in which an active area configured to display an image and a peripheral area disposed adjacent to the active area are defined, a light source configured to provide a light to the display panel, an optical member disposed between the light source and the display panel, a light blocking layer covering a side surface of the optical member, a support member supporting the optical member, and an intermediate protective member disposed between the display panel and the light source to support the display panel. The support member is supported by the intermediate protective member.

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2N (where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.

Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.

Abstract: A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.

Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: Exemplary embodiments of the present invention relate to a backlight assembly and a display device, including a backlight unit including a light emitting diode (LED) light source of and a light guide, and a bottom chassis disposed at a rear surface of the backlight unit, wherein the bottom chassis includes a bottom chassis main body, an inner supporting member disposed at an inner surface of the bottom chassis main body, an outer supporting member disposed at an outer surface of the bottom chassis main body, and a fastener to fasten at least two of the bottom chassis main body, the inner supporting member, and the outer supporting member.

Abstract: Exemplary embodiments of the present invention relate to a backlight assembly and a display device, including a backlight unit including a light emitting diode (LED) light source of and a light guide, and a bottom chassis disposed at a rear surface of the backlight unit, wherein the bottom chassis includes a bottom chassis main body, an inner supporting member disposed at an inner surface of the bottom chassis main body, an outer supporting member disposed at an outer surface of the bottom chassis main body, and a fastener to fasten at least two of the bottom chassis main body, the inner supporting member, and the outer supporting member.