Abstract: A preparation process of 5-ethylidene-2-norbornene, including: introducing dicyclopentadiene into a dicyclopentadiene decomposition reactor to thermally decompose the dicyclopentadiene; introducing a product of the above step into a cyclopentadiene purification tower; introducing 1,3-butadiene, a solvent, and cyclopentadiene separated from the top of the cyclopentadiene purification tower into a Diels-Alder reactor to react the same; introducing a product of the immediate above step into a 1,3-butadiene removal tower to recover 1,3-butadiene from the top; introducing a mixture at the bottom of the 1,3-butadiene removal tower into a desolvation tower, and recycling a solvent and unreacted raw materials recovered from the top of the desolvation tower to the dicyclopentadiene decomposition reactor; introducing a mixture at the bottom of the desolvation tower into a 5-vinyl-2-norbornene separation tower to separate 5-vinyl-2-norbornene; and introducing the 5-vinyl-2-norbornene into an isomerization reactor to rea

Abstract: An image sensor module is provided. The image sensor module includes an image sensor which has a rectangular shape having a long side and a short side; a substrate which has a long side corresponding to the long side of the image sensor and a short side corresponding to the short side of the image sensor, wherein the image sensor is mounted on the substrate; a sub-housing installed on the substrate, the sub-housing having a first sidewall disposed on a side corresponding to the long side of the image sensor and a second sidewall disposed on a side corresponding to the short side of the image sensor; and an adhesive which bonds the sub-housing and the substrate, wherein a side surface of the substrate, disposed on the long side of the substrate and an outer surface of the adhesive are disposed on a same plane.

Abstract: A camera module includes : a housing in which a lens barrel is accommodated; a circuit board fixedly mounted on a lower portion of the housing; and a guide member guiding a fixing position of the housing fixed to the circuit board, wherein the guide member includes a solder ball, formed on the circuit board to protrude in an upward optical axis direction and a guide groove, provided as a groove recessed in the upward optical axis direction in a lower end portion of the housing and into which the solder ball is fitted.

Abstract: A camera module includes : a housing in which a lens barrel is accommodated; a circuit board fixedly mounted on a lower portion of the housing; and a guide member guiding a fixing position of the housing fixed to the circuit board, wherein the guide member includes a solder ball, formed on the circuit board to protrude in an upward optical axis direction and a guide groove, provided as a groove recessed in the upward optical axis direction in a lower end portion of the housing and into which the solder ball is fitted.

Abstract: Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.

Abstract: Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.

Abstract: The present invention provides an improved receiver capable of receiving either a satellite broadcast signal or a cable TV signal associated with a TV. The inventive receiver comprises a first BPF for filtering received broadcast signals, a first local oscillator for generating a first oscillation signal, a first mixer for generating a first IF signal, a SAW filter producing a waveformed band signal, a second local oscillator, for generating a second and a third oscillation signal, a second mixer for generating a second and a third IF signal, a switching block for switching the second and the third IF signal, a second BPF for producing a baseband channel signal selected from the cable TV signal, a first LPF for producing a baseband I signal of satellite broadcast channel, a shifter for shifting a phase of the third IF signal, a third mixer for generating a phase-shifted third oscillation signal, and a second LPF for producing a baseband Q signal of satellite broadcast channel.

Abstract: The disclosure describes an apparatus for correcting a frequency offset in a OFDM receiving system.