Abstract: The present subject matter relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

Abstract: A method of manufacturing a semiconductor device includes forming a plurality of fins by forming a plurality of first device isolating trenches repeated at a first pitch in a substrate, forming a plurality of fin-type active areas protruding from a top surface of a first device isolating layer by forming the first device isolating layer in the plurality of first device isolating trenches, forming a plurality of second device isolating trenches at a pitch different from the first pitch by etching a portion of the substrate and the first device isolating layer, and forming a second device isolating layer in the plurality of second device isolating trenches, so as to form a plurality of fin-type active area groups separated from each other with the second device isolating layer therebetween.

Abstract: A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected to the semiconductor chip, a thermal conductive layer disposed on the second surface of the semiconductor chip, a sealing layer surrounding a side surface of the semiconductor chip and a side surface of the thermal conductive layer, and a second redistribution portion disposed on the sealing layer, the second redistribution portion including a first upper wiring layer connected to the thermal conductive layer, the second redistribution portion including a second upper wiring layer electrically connected to the semiconductor chip.

Abstract: A cosmetic composition containing a complex extract of Sargassum horneri and Enteromorpha prolifera, which is capable of exhibiting antioxidant activity. The cosmetic composition of the invention contains a complex extract of Sargassum horneri and Enteromorpha prolifera as an active ingredient.

Abstract: A display device includes a display unit including a plurality of pixels to display a display image, a luminance detector to detect luminance of an image on the display unit, and a display driver. The display divider is to divide the display unit into image areas symmetrical to each other and to adjust a luminance of an image area having a relatively lower luminance value among the image areas symmetrical to each other based on a luminance detection result.

Abstract: The present invention relates to a magnetic cesium adsorbent, a preparation method therefor, and a cesium removal method using the same, the preparation method comprising the steps of: (a) preparing a metal hexacyanoferrate; and (b) hydrothermally reacting the metal hexacyanoferrate so as to prepare a metal hexacyanoferrate having a rhombohedral crystal structure.

Abstract: A directional speaker and a display apparatus having the same are provided. In particular, the display apparatus includes a pair of directional speakers as a surround sound speaker, wherein each directional speaker includes a driver to generate sound and a guide tube provided with sound radiated holes linearly aligned on one surface thereof.

Abstract: Power management apparatuses are provided. A power management apparatus includes a secondary power device that includes at least one capacitor. The power management apparatus includes a charging circuit that includes a direct current (DC)-DC converter and that is configured to supply power to the secondary power device. Moreover, the power management apparatus includes a measuring circuit that is configured to measure a switching profile of the DC-DC converter, and to determine a state of the secondary power device by comparing at least one time period of the switching profile with a reference time. Related memory systems and methods of operation are also provided.

Abstract: Disclosed is a vehicular camera module having an improved printed circuit board arrangement to downsize the apparatus. A printed circuit board according to one embodiment of the present invention has an image sensor and at least one connector arranged thereon, and can comprise at least one auxiliary substrate connected to the printed circuit board at a predetermined angle by the connector, and an housing attached to the printed circuit board.

Abstract: Disclosed is a sample collection apparatus. The sample collection apparatus relates to a sample collection apparatus configured to be capable of stably collecting sediment from a seabed without disturbing the same and to be capable of easily separating and transporting a box itself containing a sample from the sample collection apparatus. Briefly, the sample collection apparatus includes a frame section, a vertical operation section, and a rotary operation section.

Abstract: The present invention provides an electronic device having a flexible display panel wherein a user can easily fold or unfold a plurality of unit bodies to expand or contract the display area of the flexible display panel, and when the unit bodies are folded, a portion of the flexible display panel is received in the hollow unit body.

Abstract: An electronic device including: a first functional panel having a photovoltaic cell panel defined as an upper portion thereof; a second functional panel having a display panel defined as an upper portion thereof; and a linking mechanism for connecting the first functional panel and the second functional panel to each other. A mutual-orientation between the first functional panel and the second functional panel is switched between a plurality of mutual-orientations via the linking mechanism.

Abstract: A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.

Abstract: A speech signal recognition method, apparatus, and system. The speech signal recognition method may include obtaining by or from a terminal an output of a personalization layer, with respect to a speech signal provided by a user of the terminal, having been implemented by input of the speech signal to the personalization layer, the personalization layer being previously trained based on speech features of the user, implementing a global model by providing the obtained output of the personalization layer to the global model, the global model being configured to output a phonemic signal indicating a phoneme included in the speech signal through the global model being previously trained based on speech features common to a plurality of users, and re-training the personalization layer based on the phonemic signal output from the global model, where the personalization layer and the global model collectively represent an acoustic model.

Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.

Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Cr: 3-18 at %; Fe: 3-60 at %; Mn: 3-40 at% ; Ni: 20-80 at %: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less.