Abstract: Disclosed is a device for optical sensing, comprising: a display comprising a transparent substrate and a plurality of light emitters disposed above the transparent substrate; a transparent cover layer disposed above the display, wherein a top surface of the transparent cover layer provides an input surface for sensing an input object; and, an angled filter disposed below the transparent substrate of the display, wherein the angled filter is configured to allow light within a tolerance angle of an acceptance angle to pass through the angled filter, wherein the acceptance angle is centered around a non-zero angle relative to a normal of the input surface.

Abstract: An optical sensor device includes: a display layer, comprising a light source configured to generate light incident on an input surface of the optical sensor device; an image sensor layer, disposed below the display layer, comprising an optical image sensor having a plurality of image sensor pixels; and a first ambient light filter layer, disposed between the display layer and the image sensor layer, configured to block one or more wavelengths of light.

Abstract: An optical sensor device includes: a display layer, comprising a light source configured to generate light incident on an input surface of the optical sensor device; an image sensor layer, disposed below the display layer, comprising an optical image sensor having a plurality of image sensor pixels; and a first ambient light filter layer, disposed between the display layer and the image sensor layer, configured to block one or more wavelengths of light.

Abstract: An optical sensor system includes: an input surface providing a sensing region for a biometric object; a plurality of display elements, disposed beneath the input surface, configured to emit light to provide a display; an aperture layer, disposed beneath the plurality of display elements; a collimator layer, disposed beneath the aperture layer; and a plurality of light sensing elements, disposed beneath the collimator layer, wherein the plurality of light sensing elements are configured to detect light from the sensing region that has passed through the aperture layer and the collimator layer.

Abstract: Disclosed is a device for optical sensing, comprising: a display comprising a transparent substrate and a plurality of light emitters disposed above the transparent substrate; a transparent cover layer disposed above the display, wherein a top surface of the transparent cover layer provides an input surface for sensing an input object; and, an angled filter disposed below the transparent substrate of the display, wherein the angled filter is configured to allow light within a tolerance angle of an acceptance angle to pass through the angled filter, wherein the acceptance angle is centered around a non-zero angle relative to a normal of the input surface.

Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.

Abstract: An optical fingerprint sensor includes: cover glass for receiving a finger; a transparent electrode layer below a bottom surface of the cover glass; an organic light emitting diode layer (OLED) below the transparent electrode layer; and a metal electrode layer below the OLED layer. Multiple openings extend through each of the transparent electrode layer, OLED layer, and metal electrode layer, and transmit reflected light reflected from a top surface of the cover glass when a finger is positioned over the top surface of the cover glass. A collimator or pinhole filter is below the metal electrode layer, and includes multiple apertures for transmitting the reflected light after the reflected light is transmitted through the multiple openings. An imager is below the bottom surface of the collimator or pinhole filter, and includes an array of pixels that detects the reflected light after the reflected light is transmitted through the multiple apertures.

Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.

Abstract: An optical biometric sensor includes an array of light sensing elements, an array of diverging optical elements, and an array of apertures disposed between the array of light sensing elements and the array of diverging optical elements. Light incident on the diverging optical elements within a limited acceptance angle passes through the apertures and towards the light sensing elements and light incident on the diverging optical elements outside of the limited acceptance angle diverges away from the apertures.

Abstract: An optical biometric sensor includes an array of light sensing elements, an array of diverging optical elements, and an array of apertures disposed between the array of light sensing elements and the array of diverging optical elements. Light incident on the diverging optical elements within a limited acceptance angle passes through the apertures and towards the light sensing elements and light incident on the diverging optical elements outside of the limited acceptance angle diverges away from the apertures.

Abstract: An optical sensor system includes: an input surface providing a sensing region for a biometric object; a plurality of display elements, disposed beneath the input surface, configured to emit light to provide a display; an aperture layer, disposed beneath the plurality of display elements; a collimator layer, disposed beneath the aperture layer; and a plurality of light sensing elements, disposed beneath the collimator layer, wherein the plurality of light sensing elements are configured to detect light from the sensing region that has passed through the aperture layer and the collimator layer.

Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.

Abstract: An optical fingerprint sensor includes: cover glass for receiving a finger; a transparent electrode layer below a bottom surface of the cover glass; an organic light emitting diode layer (OLED) below the transparent electrode layer; and a metal electrode layer below the OLED layer. Multiple openings extend through each of the transparent electrode layer, OLED layer, and metal electrode layer, and transmit reflected light reflected from a top surface of the cover glass when a finger is positioned over the top surface of the cover glass. A collimator or pinhole filter is below the metal electrode layer, and includes multiple apertures for transmitting the reflected light after the reflected light is transmitted through the multiple openings. An imager is below the bottom surface of the collimator or pinhole filter, and includes an array of pixels that detects the reflected light after the reflected light is transmitted through the multiple apertures.

Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.

Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.

Abstract: The present invention relates to cost effective production methods of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.

Abstract: A method for providing a biometric sensor arrangement includes: forming the biometric sensor comprising sensor elements and a controller IC disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer.

Abstract: A biometric sensor and button assembly and method of making same are disclosed which may comprise: a button housing comprising at least two side walls each forming a vertical load absorbing tower and defining an opening within the button housing; an insert within the opening within the housing; a sensor controller integrated circuit positioned within a cavity formed in one of the insert, the housing or a combination of the insert and the housing; and the insert and the housing cooperating to absorb vertical loading on the button housing, thereby protecting the integrated circuit from excess vertical loading. The assembly and method may also comprise the biometric comprising a fingerprint sensed by the biometric sensor. The assembly and method may also comprise the at least two side walls comprising at least four side walls, the cavity being formed within the bottom of the insert, within the housing, or both.

Abstract: The present invention relates to cost effective production methods of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.