Patents by Inventor Young Seok Jung

Young Seok Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090316821
    Abstract: An apparatus and method for power control are provided. In a receiver in a mobile communication system, a Receive (Rx) signal received through a plurality of antennas is estimated. A power ratio between a traffic channel of the Rx signal and a pilot channel of the Rx signal is determined. A Log Likelihood Ratio (LLR) value is determined using the power ratio between the traffic channel and the pilot channel, a symbol of the traffic channel, and an Rx signal estimation value to which precoding is applied.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 24, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Seok Jung, Bong-Gee Song, Kwang-Man Ok, Chae-Man Lim
  • Publication number: 20090298563
    Abstract: Disclosed is a handheld electronic device including a sliding mechanism configured to interconnect a first body and a second body such that the first and second bodies are slidable with reference to the other. The sliding mechanism includes a first sliding member configured to be secured to the first body and a second sliding member configured to be secured to the second body, the second sliding member slidably engaged with the first sliding member and slidable relative to the first sliding member between a first position and a second position. The device further has a spring comprising an undulating portion interposed between a first point and a second point of the spring's wire. The first point is secured to the first sliding member, and the second point is secured to the second sliding member. The undulating portion is configured to be compressed and released as the first sliding member slides between the first and second positions.
    Type: Application
    Filed: August 21, 2009
    Publication date: December 3, 2009
    Applicant: AMPHENOL PHOENIX CO., LTD.
    Inventors: Young-Seok Jung, Woog-Soo Shin, Jae-Ku Jun, Jong-Woong Kang
  • Patent number: 7564916
    Abstract: Disclosed is a method for encoding messages with space-time trellis codes(STTC) and transmitting the encoded messages in communication system provided with at least two transmit antennas and at least one receive antenna. The method comprising generating a codeword by encoding message using STTC; generating a modified codeword by multiplying the codeword by unitary matrix V; and multiplying the modified codeword by weighting matrix W, and then transmitting it through transmit antennas. The weighting matrix W is determined depending on channel information fed back to the transmit antenna from the receive antenna. The unitary matrix V is the value that minimizes the union bound of frame error rate, and is chosen by computer search. Result of a simulation using the method shows that the performance of the STTC is improved over a wide range of feedback channel condition.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: July 21, 2009
    Assignee: Seoul National University Industry Foundation
    Inventors: Jae Hong Lee, Young Seok Jung
  • Publication number: 20090129522
    Abstract: An apparatus and method for parallel symbol cancellation in a Multiple Input Multiple Output (MIMO) system supporting spatial multiplexing. The method includes selecting one of four quadrants representing all points on a constellation having normalization distribution, selecting a single reference point in the selected quadrant and generating a reference value corresponding to the single reference point, generating addition values for representing other points than the single reference point using a difference of a size of each of the points having the normalization distribution, and summing up the reference value and the addition values. The apparatus includes modules configured for performing the parallel symbol cancellation with reduced complexity.
    Type: Application
    Filed: November 19, 2008
    Publication date: May 21, 2009
    Inventors: Byung-Jik SON, Young-Seok Jung
  • Publication number: 20090129284
    Abstract: An apparatus and method for reporting a Channel Quality Indicator (CQI) in a wireless communication system are provided. The method includes estimating a per-subband CQI with respect to each transport layer and generating a broadband CQI with respect to each transport layer according to the per-subband CQI, comparing the broadband CQI and the per-subband CQI with respect to each transport layer to determine a difference value thereof, determining an offset value to be used in a differential CQI, determining the differential CQI by subtracting the offset value from the determined difference value, and transmitting a transmission symbol by converting the determined differential CQI into the transmission symbol.
    Type: Application
    Filed: November 18, 2008
    Publication date: May 21, 2009
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Young-Seok JUNG, Kwang-Man OK, Chae-Man LIM
  • Patent number: 7526047
    Abstract: A method for coding messages by group codes over label alphabet and H-symmetric labeling is provided in order to encode geometrically uniform space-time trellis codes considering a distance spectrum. The coding method makes the complexity of code searching reduced considerably by limiting the object of the code design to geometrically uniform space-time trellis codes (STTCs). Therefore, it is possible to design the STTCs with many states, and also design the STTCs with superior performance.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: April 28, 2009
    Assignee: Seoul National University Industry Foundation
    Inventors: Jae Hong Lee, Young Seok Jung
  • Publication number: 20090060094
    Abstract: Provided is a transmitting/receiving apparatus and method for an IDMA system. The receiving apparatus includes a channel estimator, an estimator, and a determiner. The channel estimator estimates a channel using a multi-user signal received through at least one RX antenna. The estimator estimates the noise power and the signal power for each transmission layer of each user by using the estimated channel value from the channel estimator. The determiner determines the number of transmission layers for each user and an MCS level for each transmission layer by using the signal power and the noise power estimated by the estimator.
    Type: Application
    Filed: August 20, 2008
    Publication date: March 5, 2009
    Inventors: Young-Seok Jung, Kwang-Man Ok, Chae-Man Lim
  • Publication number: 20090046031
    Abstract: An intenna connecting apparatus for electrically connecting an intenna, which is inserted into a mobile communication terminal, to a printed circuit substrate installed below the intenna is provided. The intenna connecting apparatus includes a conductive plate electrically connected to circuit patterns of the printed circuit substrate, and a conductive medium installed on an upper surface of the conductive plate, the conductive medium including an elastic polymer material and a plurality of conductors contained in the elastic polymer material, wherein as the intenna is pressed down on the conductive medium, the conductive medium is compacted and the conductors come into contact with each other, and thus the antenna and the circuit patterns of the printed circuit substrate are electrically connected to each other.
    Type: Application
    Filed: August 5, 2008
    Publication date: February 19, 2009
    Inventor: Young Seok JUNG
  • Publication number: 20090028671
    Abstract: An in-line system for manufacturing a semiconductor package according to principles of the present invention can prevent wafer warpage due to a back-lap process and die defects due to sticking of the die. In one embodiment, the in-line system adheres a semiconductor chip to a substrate by coating a liquid adhesive agent on a rear surface of the wafer. The processes of the in-line system are preferably performed in series. More particularly, the in-line system for manufacturing a semiconductor package can include a loading unit for loading a wafer into the system. A back-lap unit can include a grinder configured to back-grind a rear surface of the wafer received from the loading unit. A cleansing unit preferably comprises an air pressure plasma generating unit for cleansing the wafer using air pressure plasma. A coating unit can be configured to form an adhesive layer on a rear surface of the cleansed wafer by using a nozzle to coat a liquid adhesive agent onto the wafer.
    Type: Application
    Filed: November 20, 2007
    Publication date: January 29, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-Tae Jin, Young-Seok Jung, Bong-Su Cho
  • Publication number: 20080207284
    Abstract: Disclosed is a handheld electronic device including a sliding mechanism configured to interconnect a first body and a second body such that the first and second bodies are slidable with reference to the other. The sliding mechanism includes a first sliding member configured to be secured to the first body and a second sliding member configured to be secured to the second body, the second sliding member slidably engaged with the first sliding member and slidable relative to the first sliding member between a first position and a second position. The device further has a spring comprising an undulating portion interposed between a first point and a second point of the spring's wire. The first point is secured to the first sliding member, and the second point is secured to the second sliding member. The undulating portion is configured to be compressed and released as the first sliding member slides between the first and second positions.
    Type: Application
    Filed: March 20, 2008
    Publication date: August 28, 2008
    Applicant: AMPHENOL PHOENIX CO., LTD.
    Inventors: Young-Seok Jung, Woog-Soo Shin, Jae-Ku Jun, Jong-Woong Kang
  • Publication number: 20080031510
    Abstract: The surfaces of wafers polished in CMP equipment are monitored in real time to detect a normal/abnormal state of operation of the CMP equipment. A camera is disposed alongside a path along which a wafer is transferred to a cassette stage from a cleaning unit. The camera is oriented to capture an image of the surface of the wafer which has been polished and cleaned. An image processor processes the color image of the surface of the wafer captured by the camera into data of the contrast between and color of areas of the image. A controller receives the data output by the image processor. The controller is connected to a database in which data of at least one color reference image is stored. The reference image(s) is/are correlated to process conditions of the CMP process. The controller (selectively) compares the processed color image with the color reference image that is stored in the database, and based on the comparison determines whether a defect exists in the polishing process.
    Type: Application
    Filed: February 6, 2007
    Publication date: February 7, 2008
    Inventor: Young-Seok Jung
  • Patent number: 5712780
    Abstract: The present invention provides a high quality power supply, and more particularly to an improved single-ended converter having the high power factor close to unity. In accordance with the present invention, the power supply comprises a power source, a low-pass filter, a rectifier including an inductor, a transformer primary coil, a transformer secondary coil, a ripple energy storing capacitor, a switching controller and an inductance element wound round a core where said transformer primary and secondary coils are wound. The inductance element being coupled to said rectifying means so that compensates a voltage applied to said inductor in said rectifying means with a voltage applied to said transformer primary coil.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: January 27, 1998
    Assignee: Korea Telecommunication Authority
    Inventors: Myoung Joong Youn, Gun Woo Moon, Young Seok Jung, Chung Wook Roh, Che Hong Ahn