Abstract: A computed tomography (CT) apparatus according to various embodiments may include a gantry including a first rotation device, a second rotation device and a third rotation device which have a ring shape, share an axis of rotation, and are rotatable independently of one another, a plurality of first light sources provided on the first rotation device at regular intervals and configured to emit X-rays to a subject, a plurality of second light sources provided on the second rotation device at regular intervals and configured to emit X-rays to the subject, a detector provided on a region of the third rotation device and configured to detect X-rays passing through the subject, and one or more processors.

Abstract: A scrubber system may include a scrubber housing including a vertically extended cleaning space, an inflow chamber coupled to a bottom portion of the scrubber housing, and first and second inflow portions, each of which is configured to supply a gas into the inflow chamber. The inflow chamber may include a mixing space, and the mixing space may be connected to the cleaning space. The first inflow portion may include a first connection pipe coupled to the inflow chamber to provide a first connection path and the second inflow portion may include a second connection pipe coupled to the inflow chamber to provide a second connection path. The first and second connection paths may be extended toward the mixing space in opposite directions, respectively, and may be connected to opposite portions of the mixing space, respectively.

Abstract: A scrubber system may include a scrubber housing including a vertically extended cleaning space, an inflow chamber coupled to a bottom portion of the scrubber housing, and first and second inflow portions, each of which is configured to supply a gas into the inflow chamber. The inflow chamber may include a mixing space, and the mixing space may be connected to the cleaning space. The first inflow portion may include a first connection pipe coupled to the inflow chamber to provide a first connection path and the second inflow portion may include a second connection pipe coupled to the inflow chamber to provide a second connection path. The first and second connection paths may be extended toward the mixing space in opposite directions, respectively, and may be connected to opposite portions of the mixing space, respectively.

Abstract: A method of fabricating a semiconductor device includes providing a wafer inside a process chamber, performing an ALD (atomic layer deposition) process inside the process chamber to deposit titanium nitride on the wafer, providing a process gas used for the ALD process to a scrubber, filtering a first powder contained in the process gas, using a filter unit disposed in the scrubber and including a plurality of filters, adsorbing a second powder remaining in the process gas after passing through the filter unit, using a fin structure extending in a vertical direction inside the filter unit, and exhausting the process gas, from which the first and second powders are removed, from the scrubber.

Abstract: The present invention relates to a system for separating and recycling a perfluorinated or perfluor compound, and more particularly, to a system for separating and recycling a perfluorinated compound, which is developed to prevent damage of separation membranes and degradation of the separation efficiency of through the application of a constant pressure to respective separation membranes when the perfluoro compound passes through a plurality of separation membranes in a process of effectively separating, removing and recycling the perfluoro compound including sulfur hexafluoride primarily generated in a semiconductor manufacturing process.

Abstract: The present invention relates to a system for separating and recycling a perfluorinated or perfluor compound, and more particularly, to a system for separating and recycling a perfluorinated compound, which is developed to prevent damage of separation membranes and degradation of the separation efficiency of through the application of a constant pressure to respective separation membranes when the perfluoro compound passes through a plurality of separation membranes in a process of effectively separating, removing and recycling the perfluoro compound including sulfur hexafluoride primarily generated in a semiconductor manufacturing process.

Abstract: An apparatus for supplying a chemical solution includes a mother tank storing a chemical solution, an intermediate tank disposed in a higher position than the mother tank with a first height difference (h), and the intermediate tank is adapted to receive a fixed amount of chemical solution from the mother tank. The apparatus further includes a bubbling tank disposed in a higher position than the intermediate tank with a second height difference (h?) and the bubbling tank is adapted to receive the fixed amount of the chemical solution from the intermediate tank.

Abstract: A gas delivery system for providing a gas to manufacturing equipment includes a gas supply unit for providing the gas to the manufacturing equipment including devices to regulate the supply of gas from the gas supply unit to the manufacturing equipment. The system includes a main control unit for regulating the supply of the gas to the manufacturing equipment. The gas delivery system includes a supplemental control unit which receives an emergency shutdown signal from the main control unit for closing off the supply of gas in response to a malfunction of the main control unit and generates a signal for maintaining a gas flow to operate the manufacturing equipment until the cause of the malfunction has been determined. With the system, an unnecessary emergency shutdown of gas supply to semiconductor manufacturing equipment in response to a malfunction of a main controller can be prevented.

Abstract: A gas delivery system for providing a gas to manufacturing equipment includes a gas supply unit for providing the gas to the manufacturing equipment including devices to regulate the supply of gas from the gas supply unit to the manufacturing equipment. The system includes a main control unit for regulating the supply of the gas to the manufacturing equipment. The gas delivery system includes a supplemental control unit which receives an emergency shutdown signal from the main control unit for closing off the supply of gas in response to a malfunction of the main control unit and generates a signal for maintaining a gas flow to operate the manufacturing equipment until the cause of the malfunction has been determined. With the system, an unnecessary emergency shutdown of gas supply to semiconductor manufacturing equipment in response to a malfunction of a main controller can be prevented.