Young Seok SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A flip chip includes a substrate, an electrode pad layer stacked over the substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked over the electrode pad layer and the passivation layer, and a bump formed over the UBM layer. The width of an opening on which the passivation layer is not formed over the electrode pad layer is greater than the width of the bump. The flip chip can prevent a crack from being generated in the pad upon ultrasonic bonding.
Type:
Grant
Filed:
June 8, 2017
Date of Patent:
January 28, 2020
Assignee:
WISOL CO., LTD.
Inventors:
Young Seok Shim, Hyung Ju Kim, Joo Hun Park, Chang Dug Kim
Abstract: A flip chip includes a substrate, an electrode pad layer stacked over the substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked over the electrode pad layer and the passivation layer, and a bump formed over the UBM layer. The width of an opening on which the passivation layer is not formed over the electrode pad layer is greater than the width of the bump. The flip chip can prevent a crack from being generated in the pad upon ultrasonic bonding.
Type:
Application
Filed:
June 8, 2017
Publication date:
December 14, 2017
Inventors:
Young Seok SHIM, Hyung Ju KIM, Joo Hun PARK, Chang Dug KIM
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