Abstract: Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in the semiconductor manufacturing equipment, and includes a housing having an inner space configured to contain the process fluid, a spray nozzle configured to spray the process fluid containing ozone into the inner space in the form of mist, and a nozzle heater configured to heat the process fluid passing through the spray nozzle.

Abstract: Proposed are a wafer heating apparatus and a wafer processing apparatus using the same. More particularly, proposed are a wafer heating apparatus having an improved structure to enable efficient cooling of a terminal block, and a wafer processing apparatus using the same. A wafer heating apparatus for heating a wafer according to one embodiment includes a heater disposed below the wafer and configured to serve as a heat source, a cooling plate disposed below the heater and configured to provide cool air, and a terminal block configured to supply power to the heater and having a lower end portion in contact with the cooling plate.

Abstract: A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.

Abstract: A spray unit in which a plurality of nozzle heads are integrally coupled and a substrate treatment apparatus including the spray unit are provided. The substrate treatment apparatus includes: a substrate support unit supporting a substrate and including a spin head, which rotates the substrate; a treatment liquid retrieval unit retrieving substrate treatment liquids used in treating the substrate; and a spray unit including a plurality of nozzle heads and pipes, which are connected to the nozzle heads, and providing the substrate treatment liquids onto the substrate through the nozzle heads and the pipes, wherein the nozzle heads are moved at the same time.

Abstract: Provided are an ozone water decomposition apparatus and method that can decompose ozone water quickly and stably.

Abstract: Disclosed is a method of decomposing ozone in ozone water. According to the present invention, a temperature of ozone water is increased by mixing ozone water with heated water, and the ozone in the ozone water is decomposed into oxygen by the increase in the temperature.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an inner space therein; a fluid supply unit having a supply line configured to supply a treating fluid to the inner space and a fluid supply source configured to supply the treating fluid to the supply line; a first exhaust unit configured to exhaust the inner space; a second exhaust unit configured to exhaust the supply line; and a controller configured to control the fluid supply unit, the first exhaust unit, and the second exhaust unit, and wherein the controller controls the fluid supply unit and the second exhaust unit so a pressure of the supply line is maintained at a critical pressure of the treating fluid or above during at least a part of a standby step for keeping a substrate outside the inner space before introducing thereof into the inner space.

Abstract: A substrate type sensor includes a substrate shape member, a pressure sensor panel provided at the substrate shape member, the pressure sensor panel including a plurality of pressure sensors, a central module including a transmission unit, the reception unit receiving data from the pressure sensor panel, and a battery proving power to the pressure sensor panel and the central module.

Abstract: A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.

Abstract: A substrate type sensor provided in an atmosphere accompanied by a temperature change to measure a horizontality of a support member that supports a substrate is disclosed. The substrate type sensor may include a base having a shape of the substrate, one or more sensors provided in the base and including 3 or more axis acceleration sensors or 6 or more axis measurement units (IMUs), a receiver configured to receive data collected by the one or more sensors and a power source configured to provide electric power to the one or more sensors and the receiver.

Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.

Abstract: The present invention relates to a method for preparing a spiro quaternary ammonium salt comprising reacting a cyclic secondary amine with a dihaloalkane in the presence of a basic resin. According to the preparation method of the present invention, a metal salt and halide ion are removed by filtration without any additional purification process, the spiro ammonium derivative compound can be obtained with high yield, and the resin can be reused through a simple treatment process.

Abstract: The present invention relates to a method for preparing a spiro quaternary ammonium salt comprising reacting a cyclic secondary amine with a dihaloalkane in the presence of a basic resin. According to the preparation method of the present invention, a metal salt and halide ion are removed by filtration without any additional purification process, the spiro ammonium derivative compound can be obtained with high yield, and the resin can be reused through a simple treatment process.

Abstract: The present invention relates to a method for using, as a carbon dioxide absorbent, a secondary amine having a nitrile group, that is, a 3-(alkylamino)propionitrile compound. The absorbent based on the 3-(alkylamino)propionitrile compound and the carbon dioxide absorption method and separation method using same, according to the present invention, not only have an excellent carbon dioxide absorption capacity and a rapid carbon dioxide absorption rate, but also allow absorbent regeneration even at a considerably low temperature compared with a conventional alkanolamine-based absorbent and thus can significantly reduce the entire energy consumption required for an absorption process, and can also prevent recovered carbon dioxide from being contaminated with moisture and absorbent vapor, owing to the low regeneration temperature.

Abstract: The present invention relates to a method for using, as a carbon dioxide absorbent, a secondary amine having a nitrile group, that is, a 3-(alkylamino)propionitrile compound. The absorbent based on the 3-(alkylamino)propionitrile compound and the carbon dioxide absorption method and separation method using same, according to the present invention, not only have an excellent carbon dioxide absorption capacity and a rapid carbon dioxide absorption rate, but also allow absorbent regeneration even at a considerably low temperature compared with a conventional alkanolamine-based absorbent and thus can significantly reduce the entire energy consumption required for an absorption process, and can also prevent recovered carbon dioxide from being contaminated with moisture and absorbent vapor, owing to the low regeneration temperature.