Patents by Inventor Young Seung Chi

Young Seung Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically conductive metal composite embroidery yarn and embroidered circuit using thereof
    Patent number: 8505474
    Abstract: The present invention relates to an electrically conductive metal composite embroidery yarn and embroidered circuit using thereof which may be applicable to smart textiles. More particularly, this invention relates to an electrically conductive metal composite embroidery yarn and embroidered circuit for smart textiles which can be used as power supply and signal transmission lines. The present invention provides an embroidered circuit which consists of a metal composite embroidery yarn and a dielectric fabric substrate, wherein the electrically conductive metal composite embroidery yarn is embroidered on the dielectric fabric substrate to form a circuit.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: August 13, 2013
    Assignee: SNU R&DB Foundation
    Inventors: Tae Jin Kang, Byung Duck Kim, Young Seung Chi, Jung Sim Roh
  • ELECTRICALLY CONDUCTIVE METAL COMPOSITE EMBROIDERY YARN AND EMBROIDERED CIRCUIT USING THEREOF
    Publication number: 20100199901
    Abstract: The present invention relates to an electrically conductive metal composite embroidery yarn and embroidered circuit using thereof which may be applicable to smart textiles. More particularly, this invention relates to an electrically conductive metal composite embroidery yarn and embroidered circuit for smart textiles which can be used as power supply and signal transmission lines. The present invention provides an embroidered circuit which consists of a metal composite embroidery yarn and a dielectric fabric substrate, wherein the electrically conductive metal composite embroidery yarn is embroidered on the dielectric fabric substrate to form a circuit.
    Type: Application
    Filed: July 30, 2008
    Publication date: August 12, 2010
    Applicant: SNU R&DB FOUNDATION
    Inventors: Tae-Jin Kang, Byung Duck Kim, Young Seung Chi, Jung Sim Roh