Abstract: An embodiment vehicle air conditioner includes an air conditioning device connected to a blower device to receive air supplied from the blower device, a heat exchange core provided in the air conditioning device and disposed in parallel with a flow direction of the air supplied from the blower device, a partition wall disposed to divide the heat exchange core into a first core part disposed to be close in distance to the blower device and a second core part disposed to be distant from the blower device, such that the air supplied from the blower device is distributed and supplied to the first core part and the second core part, and an air guide provided in a connection portion between the blower device and the air conditioning device and configured to guide the air to be supplied to the second core part of the heat exchange core.

Abstract: A camera device according to an embodiment of the present invention includes a light output unit which emits light signals having a predetermined pattern to an object, a light input unit which receives light signals reflected by the object, a depth map generation unit which generates a depth map of the object using the light signal input to the light input unit, and a control unit which controls the light output unit, the light input unit, and the depth map generation unit, wherein the light output unit includes a plurality of light sources including a first light source and a second light source, the light input unit includes an image sensor, the first light source and the second light source are symmetrically disposed with the image sensor interposed therebetween, the first light source outputs first light signals having a first pattern formed of a plurality of dots, the second light source outputs second light signals having a second pattern formed of a plurality of dots, and the plurality of dots forming

Abstract: A method of manufacturing an iron bus bar includes preparing an iron core and forming a copper layer having a thickness of 10 to 30 ?m on the iron core by coating. The manufactured iron bus bar has high strength and durability as well as excellent electrical conductivity can be manufactured at low cost.

Abstract: Disclosed are a method of forming a seed layer on a high-aspect ratio via and a semiconductor device having a high-aspect ratio via formed thereby. Thus, efficient Cu filling-plating is possible, and plating adhesion of the seed layer to filling-plated Cu can be simply and profitably enhanced, thus imparting high durability upon forming metal wiring for electronic components. Moreover, stress of the seed layer can be lowered, thereby enhancing plating adhesion.

Abstract: The present invention relates to an exclusive alloy substrate material for CIGS solar cells. Particularly, the present invention provides a substrate material having a thermal expansion coefficient similar to that of a CIGS layer. The substrate material according to the present invention may prevent damage such as interlayer separation due to differing thermal expansion coefficients from occurring because the substrate material has a thermal expansion coefficient similar to that of the CIGS layer.

Abstract: This invention relates to a method of forming a fine pattern, and more particularly, to a method of forming a fine pattern using only sputtering, which enables the fine pattern to be simply formed at low cost, thus exhibiting superior productivity and economic benefits.

Abstract: A method of manufacturing an iron bus bar includes preparing an iron core and forming a copper layer having a thickness of 10 to 30 ?m on the iron core by coating. The manufactured iron bus bar has high strength and durability as well as excellent electrical conductivity can be manufactured at low cost.

Abstract: The present invention related to an iron bus bar coated with copper and a method of manufacturing the same. The present invention provides an iron bus bar including an iron core and a copper layer applied on the iron core, and a method of manufacturing the same. According to the present invention, an iron bus bar having high strength and durability as well as excellent electrical conductivity can be manufactured at low cost.

Abstract: Disclosed are a method of forming a seed layer on a high-aspect ratio via and a semiconductor device having a high-aspect ratio via formed thereby. Thus, efficient Cu filling-plating is possible, and plating adhesion of the seed layer to filling-plated Cu can be simply and profitably enhanced, thus imparting high durability upon forming metal wiring for electronic components. Moreover, stress of the seed layer can be lowered, thereby enhancing plating adhesion.

Abstract: This invention relates to a method of forming a fine pattern, and more particularly, to a method of forming a fine pattern using only sputtering, which enables the fine pattern to be simply formed at low cost, thus exhibiting superior productivity and economic benefits.

Abstract: The present invention related to an iron bus bar coated with copper and a method of manufacturing the same. The present invention provides an iron bus bar including an iron core and a copper layer applied on the iron core, and a method of manufacturing the same. According to the present invention, an iron bus bar having high strength and durability as well as excellent electrical conductivity can be manufactured at low cost.

Abstract: The present invention relates to an exclusive alloy substrate material for CIGS solar cells. Particularly, the present invention provides a substrate material having a thermal expansion coefficient similar to that of a CIGS layer. The substrate material according to the present invention may prevent damage such as interlayer separation due to differing thermal expansion coefficients from occurring because the substrate material has a thermal expansion coefficient similar to that of the CIGS layer.