Patents by Inventor Young Soo YI
Young Soo YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240274363Abstract: A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, a first external electrode and including a first alloy layer connected to the first internal electrode; and a second external electrode and including a second alloy layer connected to the second internal electrode, wherein the first and second alloy layers include alloys including Cu, Ni and Al, and a molar content of Ni included in the first alloy layer is greater than a molar content of Al, and a molar content of Cu is greater than the molar content of Ni.Type: ApplicationFiled: January 29, 2024Publication date: August 15, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi KOO, Soung Jin KIM, Young Soo YI, San KYEONG, Yun Hee KIM
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Patent number: 11955289Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.Type: GrantFiled: April 14, 2022Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo Yi, Kun Ho Koo, San Kyeong, Hai Joon Lee, Kyung Ryul Lee, Ho Yeol Lee
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Patent number: 11894196Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.Type: GrantFiled: June 6, 2022Date of Patent: February 6, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Young Soo Yi, Kun Ho Koo, Soung Jin Kim, Ho Yeol Lee, Kyung Ryul Lee, Chang Hak Choi
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Publication number: 20230343514Abstract: A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt% or more and 0.35 wt% or less with respect to a total content of the Cu particles.Type: ApplicationFiled: December 1, 2022Publication date: October 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Ho KOO, San KYEONG, Soung Jin KIM, Young Soo YI, Ho Yeol LEE, Ic Seob KIM, Kyung Ryul LEE, Chang Hak CHOI
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Publication number: 20230187137Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.Type: ApplicationFiled: June 6, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San KYEONG, Young Soo YI, Kun Ho KOO, Soung Jin KIM, Ho Yeol LEE, Kyung Ryul LEE, Chang Hak CHOI
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Publication number: 20230178302Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.Type: ApplicationFiled: April 14, 2022Publication date: June 8, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo YI, Kun Ho KOO, San KYEONG, Hai Joon LEE, Kyung Ryul LEE, Ho Yeol LEE
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Patent number: 11574773Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: GrantFiled: September 30, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo Yi, Soung Jin Kim, Kun Hoi Koo, Jun Hyeon Kim, Kyung Ryul Lee
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Patent number: 11476047Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 ?m away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.Type: GrantFiled: May 14, 2021Date of Patent: October 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woong Do Jung, Yu Hong Oh, Kyung Ryul Lee, Kun Ho Koo, Young Soo Yi
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Publication number: 20220189696Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: ApplicationFiled: September 30, 2021Publication date: June 16, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo YI, Soung Jin KIM, Kun Hoi KOO, Jun Hyeon KIM, Kyung Ryul LEE
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Publication number: 20220122770Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 ?m away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.Type: ApplicationFiled: May 14, 2021Publication date: April 21, 2022Inventors: Woong Do JUNG, Yu Hong OH, Kyung Ryul LEE, Kun Ho KOO, Young Soo YI