Patents by Inventor Young Su Jin

Young Su Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7764445
    Abstract: An optical system is mounted in a mobile communication terminal and a personal digital assistant (PDA) for a monitoring camera and a digital camera. The optical system includes: a first optical element formed in a meniscus shape entirely convex toward an object and having a positive refractive power; and a second optical element having an object-side surface convex toward the object and an image-side surface formed of a plane, wherein the second optical element includes: a fourth optical element having an object-side surface entirety convex toward the object on the optical axis; and a fifth optical element having an object-side surface in contact with an image-side surface of the fourth optical element, and an image-side surface and an object-side surface formed of planes respectively.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: July 27, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hye Ran Oh, In Cheol Chang, Seok Cheon Lee, Young Su Jin, Cheong Hee Lee
  • Publication number: 20100053772
    Abstract: There is provided a lens assembly including: a first lens part including a first lens surface as an object-side surface, a second lens surface as an image-side surface, and a peripheral part defining a periphery of the second lens surface; a second lens part disposed at an image side of the first lens part and including at least one lens; a spacer spacing the first lens part and the second lens part from each other; and a light adjustor disposed between the second lens surface and the peripheral part, the light adjustor totally reflecting or refracting light incident at a predetermined angle of view or more.
    Type: Application
    Filed: December 30, 2008
    Publication date: March 4, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Ran Oh, In Cheol Chang, Seok Cheon Lee, Young Su Jin, Cheong Hee Lee
  • Publication number: 20090147368
    Abstract: A method for manufacturing a wafer scale lens assembly, and a wafer scale lens assembly manufactured by the same are disclosed. The method includes forming a plurality of transmissive regions and a plurality of non-transmissive regions on an object-side surface or an image-side surface of each of first and second lens substrates, forming a plurality of lens elements having refractive power on at least one of the object-side surface and the image-side surface of each of the first and second lens substrates, and stacking the first and second lens substrates, with a spacer interposed between the first lens substrate and the second lens substrate. Accordingly, image quality is improved by preventing undesired light from forming an image on an image plane of an image sensor. The process time is reduced to reduce a manufacturing cost.
    Type: Application
    Filed: December 10, 2008
    Publication date: June 11, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Ran Oh, In Cheol Chang, Seok Cheon Lee, Young Su Jin, Cheong Hee Lee
  • Publication number: 20090086339
    Abstract: There is provided a subminiature optical system mounted in a mobile communication terminal and a personal digital assistant (PDA) or used for a monitoring camera and a digital camera.
    Type: Application
    Filed: March 12, 2008
    Publication date: April 2, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Ran Oh, In Cheol Chang, Seok Cheon Lee, Young Su Jin, Cheong Hee Lee
  • Publication number: 20090040626
    Abstract: There is provided a subminiature imaging optical system subminiature imaging optical system including: a first lens element having a convex object-side surface; a second lens element having an object-side surface in contact with an image-side surface of the first lens element; and a third lens element having an object-side surface in contact with an image-side surface of the second lens element, wherein the object-side surface of the first lens element and an image-side surface of the third lens element are aspherical, and the third lens element has a point of inflection formed within an effective aperture thereof such that the image-side surface is convexed toward an image plane at a central portion to have positive refractive power and concaved toward the image plane at a peripheral portion to have negative refractive power.
    Type: Application
    Filed: August 11, 2008
    Publication date: February 12, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Ran Oh, In Cheol Chang, Seok Cheon Lee, Young Su Jin, Cheong Hee Lee
  • Publication number: 20080273239
    Abstract: There is provided an imaging lens including: a transparent substrate; an upper lens disposed on a top of the transparent substrate; and a lower lens disposed on a bottom of the transparent substrate to correspond to the upper lens, wherein one of the upper and lower lenses includes a lens element and a partition wall formed higher than the lens element to surround the lens element. Also, there is provided a method of manufacturing the same. In the imaging lens, the partition wall is replicated together with the lens element on one or both surfaces of the transparent substrate. The partition wall is formed higher than the lens element and has a flat top surface. Therefore, when another lens element is replicated on an opposite surface of the transparent substrate, the previously replicated lens element is prevented from deformation.
    Type: Application
    Filed: April 22, 2008
    Publication date: November 6, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Su Jin, In Cheol Chang, Cheong Hee Lee, Jung Eun Noh, Dong Ik Shin
  • Publication number: 20080113273
    Abstract: There are provided a wafer scale lens module and a manufacturing method thereof. A wafer scale lens module including: at least one lens including a lens substrate and a lens element deposited on at least one surface of the lens substrate, wherein a stop is integrally formed on at least one surface of the lens to adjust light amount. The stop may be a photo resist layer. The wafer scale lens module is lighter in weight and smaller in size and has a stop formed of a photo resist which is excellently bonded to a UV curing polymer, thereby precluding a need for forming an additional bonding film. The stop can be fabricated only through an exposure process due to characteristics of the photo resist, thereby saving manufacturing costs and time.
    Type: Application
    Filed: November 7, 2007
    Publication date: May 15, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Su Jin, Hye Ran Oh, In Cheol Chang