Patents by Inventor Young-sug Seong

Young-sug Seong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test socket of flexible semiconductor chip package and bending test method using the same
    Patent number: 10705116
    Abstract: A test socket of a flexible semiconductor chip package includes a first bending jig having a convex contour, a second bending jig having a concave contour, and a semiconductor chip package. The second bending jig is disposed to matingly engage the first bending jig. The semiconductor chip package is disposed between the first bending jig and the second bending jig, and includes a flexible tape and a semiconductor chip. The semiconductor chip is disposed on a surface of the flexible tape. Each of the first and second bending jigs has a horizontal length longer than a length of the semiconductor chip and less than a length of the flexible tape.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 7, 2020
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik Choi, Jin Won Jeong, Young Sug Seong, Dong Keun Lee
  • TEST SOCKET OF FLEXIBLE SEMICONDUCTOR CHIP PACKAGE AND BENDING TEST METHOD USING THE SAME
    Publication number: 20190079114
    Abstract: A test socket of a flexible semiconductor chip package includes a first bending jig having a convex contour, a second bending jig having a concave contour, and a semiconductor chip package. The second bending jig is disposed to matingly engage the first bending jig. The semiconductor chip package is disposed between the first bending jig and the second bending jig, and includes a flexible tape and a semiconductor chip. The semiconductor chip is disposed on a surface of the flexible tape. Each of the first and second bending jigs has a horizontal length longer than a length of the semiconductor chip and less than a length of the flexible tape.
    Type: Application
    Filed: May 30, 2018
    Publication date: March 14, 2019
    Applicant: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik CHOI, Jin Won JEONG, Young Sug SEONG, Dong Keun LEE
  • Magnetic sensor test apparatus and method of testing a magnetic sensor
    Patent number: 9671484
    Abstract: Provided are a magnetic sensor test apparatus and a magnetic sensor test method. The magnetic sensor test apparatus includes a vertical coil and at least one periphery coil disposed peripherally about the vertical coil. Both the vertical coil and the periphery coil may be configured to generate a horizontal and/or a vertical magnetic field in a semiconductor wafer.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: June 6, 2017
    Assignee: HAECHITECH CORPORATION
    Inventors: Ki-bog Youm, Young-bae Choi, Young-sug Seong, Kyung-seok Jin
  • MAGNETIC SENSOR TEST APPARATUS AND METHOD
    Publication number: 20150042318
    Abstract: Provided are a magnetic sensor test apparatus and a magnetic sensor test method. The magnetic sensor test apparatus includes a vertical coil configured to generate a magnetic field and at least one periphery coil. The magnetic sensor test apparatus and method may test a magnetic sensor on a semiconductor wafer.
    Type: Application
    Filed: May 27, 2014
    Publication date: February 12, 2015
    Applicant: MagnaChip Semiconductor, Ltd.
    Inventors: Ki-bog Youm, Young-bae Choi, Young-sug Seong, Kyung-seok Jin