Patents by Inventor Young-Suk RYU

Young-Suk RYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE INCLUDING BUMP
    Publication number: 20180366430
    Abstract: A semiconductor device includes a semiconductor chip having a pad which is exposed through a passivation layer, a bump pillar formed over the passivation layer adjacent to the pad, but not overlapping with the pad. The semiconductor chip also has a solder layer including a solder bump portion which is formed over the bump pillar and a solder fillet portion which is formed at one side of the bump pillar facing the pad to cover the pad and electrically couples the bump pillar and the pad.
    Type: Application
    Filed: September 13, 2017
    Publication date: December 20, 2018
    Applicant: SK hynix Inc.
    Inventors: Jun-Hyun CHO, Young-Suk RYU, Jae-Yong AN, Il-Hwan CHO
  • Semiconductor package including bump
    Patent number: 10157873
    Abstract: A semiconductor device includes a semiconductor chip having a pad which is exposed through a passivation layer, a bump pillar formed over the passivation layer adjacent to the pad, but not overlapping with the pad. The semiconductor chip also has a solder layer including a solder bump portion which is formed over the bump pillar and a solder fillet portion which is formed at one side of the bump pillar facing the pad to cover the pad and electrically couples the bump pillar and the pad.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: December 18, 2018
    Assignee: SK hynix Inc.
    Inventors: Jun-Hyun Cho, Young-Suk Ryu, Jae-Yong An, Il-Hwan Cho