Abstract: The present disclosure relates to a hydrophilic modified polymer membrane and a method for fabricating the same, and more specifically, to a polymer membrane dip-coated with double bond-containing PVDF (DPVDF) and modified to be hydrophilic by reaction with a polymer or monomer containing an amine group, and a method of fabricating the same. The polymer membrane of the present disclosure is fabricated by physically coating a porous polymer substrate by dip coating with DPVDF, and then chemically modifying the surface of the dip-coated substrate to be hydrophilic using a polymer or monomer containing an amine group. That is, the polymer membrane is fabricated by performing both physical coating and chemical coating so that the dissolution of inorganic particles in the membrane can be further suppressed.

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

Abstract: A transparent display apparatus disposed inside a vehicle is disclosed. the transparent display apparatus comprising: a transparent display panel configured to transmit light from a first surface to a second surface; a rotation part coupled to one end of the transparent display panel; an anchoring part fixed to a ceiling of the vehicle, wherein the anchoring part includes a motor coupled to at least a portion of the rotation part and configured to rotate the rotation part about a longitudinal direction of the rotation part; an interface unit mounted inside the transparent display panel and/or the vehicle to receive a user command; and a control unit operatively connected to the interface unit and the motor, and configured to perform control so that the transparent display panel is switched to a plurality of modes based on a user command received from the interface unit.

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

Abstract: Disclosed is an LED lighting apparatus with a power supply unit. The LED lighting apparatus may include: a case configured to accommodate the power supply unit; a cover configured to be in close contact with the case so that the power supply unit is shielded; a stationary bracket configured to be coupled to the case, and including a fixing plate that is flat in a horizontal direction; and a rotary bracket configured to be coupled to the cover and to be rotated about a rotary axis orthogonal to a plane formed by the fixing plate, and including a locking plate that is parallel to the fixing plate. As the rotary bracket is rotated, the cover is separated from the case in a first range where the fixing plate and the locking plate are separated from each other, and the cover is fixed to the case in a second range where the fixing plate and the locking plate are engaged with each other.

Abstract: A semiconductor device may include a substrate and a dielectric layer may be formed on the substrate. A multi-layered interconnection structure may be embedded in the dielectric layer. A plurality of bonding pads, which may be connected to an uppermost interconnection layer of the multi-layered interconnection structure, may be spaced apart in a first direction. A passivation layer may have a plurality of bonding pad openings that may be defined by a plurality of slits and respectively expose the bonding pads. The slits may overlap isolations of the bonding pads. Each of the slits may have an edge width that may be larger than a center width thereof.

Abstract: A portable computer including a housing having first and second sections, the first section having an information input device and the second section having a case having a first fastening element; a display panel including a second fastening element at a rear surface of the panel, the case and the display panel being attached through the first and second fastening elements; a hinge coupling the first and the second sections to each other; and a display panel support member having a third fastening element, the display panel support member being attached to the display panel through the third fastening element.

Abstract: A portable computer including a housing having first and second sections, the first section having an information input device and the second section having a case having a first fastening element; a display panel including a second fastening element at a rear surface of the panel, the case and the display panel being attached through the first and second fastening elements; a hinge coupling the first and the second sections to each other; and a display panel support member having a third fastening element, the display panel support member being attached to the display panel through the third fastening element.

Abstract: A portable computer including a housing having first and second sections, the first section having an information input device and the second section having a case having a first fastening element; a display panel including a second fastening element at a rear surface of the panel, the case and the display panel being attached through the first and second fastening elements; a hinge coupling the first and the second sections to each other; and a display panel support member having a third fastening element, the display panel support member being attached to the display panel through the third fastening element.

Abstract: A portable computer including a housing having first and second sections, the first section having an information input device and the second section having a case having a first fastening element; a display panel including a second fastening element at a rear surface of the panel, the case and the display panel being attached through the first and second fastening elements; a hinge coupling the first and the second sections to each other; and a display panel support member having a third fastening element, the display panel support member being attached to the display panel through the third fastening element.

Abstract: Integrated circuit memory devices include an integrated circuit substrate and a plurality of lower wiring lines on the substrate and extending in a first direction. An interlayer insulating layer is on the plurality of lower wiring lines. An upper damascene wiring line is in an upper portion of the interlayer insulating layer and extending in a second direction, different from the first direction, to extend over the plurality of lower wiring lines. The upper damascene wiring line has protruded regions extending therefrom in a direction different from the second direction, the protruded regions extending over respective underlying ones of the lower wiring lines. A first via extends through the interlayer insulating layer under a first of the protruded regions and connects the upper damascene wiring line to a corresponding underlying first one of the plurality of wiring lines.

Abstract: Disclosed is a computer that includes: a system body having an input device; a display module having a display surface and a rear surface; a display case having a side wall surface; and a hinge pivotally coupling the body to the display module, the hinge including a hinge frame having first and second surfaces, the first surface coupled with the rear surface of the display module, the second surface coupled with the side wall surface of the display case.

Abstract: A method of controlling transmission rate by using error correction packets and a communication apparatus using the same are provided. According to an embodiment of the present invention, the method of controlling transmission rate by using error correction packets includes transmitting a first packet group composed in a predetermined ratio of data packets and error correction packets, transmitting a second packet group composed of the data packets and the error correction packets in a ratio adjusted based on feedback information about the first packet group, and controlling the transmission rate based on the feedback information about the second packet group.

Abstract: A polarizer includes a base and a plurality of grids arranged on a surface of the base parallel to one another. Each of the grids comprises an intermediate layer and a semi-transmissive metal layer that reflects a part of external light incident thereon and transmits a part of the external light incident thereon. The semi-transmissive metal layer and the intermediate layer are alternately deposited to include at least two semi-transmissive metal layers. The thicknesses of the semi-transmissive metal layers increases in a direction in which the semi-transmissive metal layer is disposed away from the external light. An organic light emitting display apparatus includes the polarizer and has improved contrast and brightness.

Abstract: A method and an apparatus are provided for context-based adaptive binary arithmetic coding (CABAC) based encoding or decoding using improved selection of a context model for a high compression ratio. The method of CABAC-based encoding includes selecting a first context model based on statistics of previously input symbols and a second context model having a value of a most probable symbol (MPS) different from that of the first context model, encoding a current input symbol using the first context model if the current input symbol has a same value as that of the most probable symbol of the first context model or if the second context model cannot be selected, and encoding the current input symbol using the second context model if the current input symbol has a value different from the most probable symbol of the first context model and if the second context model can be selected.

Abstract: A method and an apparatus are provided for context-based adaptive binary arithmetic coding (CABAC) based encoding or decoding using improved selection of a context model for a high compression ratio. The method of CABAC-based encoding includes selecting a first context model based on statistics of previously input symbols and a second context model having a value of a most probable symbol (MPS) different from that of the first context model, encoding a current input symbol using the first context model if the current input symbol has a same value as that of the most probable symbol of the first context model or if the second context model cannot be selected, and encoding the current input symbol using the second context model if the current input symbol has a value different from the most probable symbol of the first context model and if the second context model can be selected.

Abstract: A semiconductor device may include a substrate and a dielectric layer may be formed on the substrate. A multi-layered interconnection structure may be embedded in the dielectric layer. A plurality of bonding pads, which may be connected to an uppermost interconnection layer of the multi-layered interconnection structure, may be spaced apart in a first direction. A passivation layer may have a plurality of bonding pad openings that may be defined by a plurality of slits and respectively expose the bonding pads. The slits may overlap isolations of the bonding pads. Each of the slits may have an edge width that may be larger than a center width thereof.

Abstract: Integrated circuit memory devices include an integrated circuit substrate and a plurality of lower wiring lines on the substrate and extending in a first direction. An interlayer insulating layer is on the plurality of lower wiring lines. An upper damascene wiring line is in an upper portion of the interlayer insulating layer and extending in a second direction, different from the first direction, to extend over the plurality of lower wiring lines. The upper damascene wiring line has protruded regions extending therefrom in a direction different from the second direction, the protruded regions extending over respective underlying ones of the lower wiring lines. A first via extends through the interlayer insulating layer under a first of the protruded regions and connects the upper damascene wiring line to a corresponding underlying first one of the plurality of wiring lines.