Abstract: A battery assembly includes a battery module stack in which at least one battery module is stacked and formed, a cover portion coupled to a side of the battery module stack, and a substrate portion coupled to an external surface of the cover portion, wherein the cover portion includes a cover member coupled to the battery module stack, and a protrusion member protruding in an outward direction from the cover member and in contact with an internal surface of the substrate portion, the substrate portion includes an overlapping region which is a region overlapping the protrusion member when viewed in the outward direction, a through-hole passing through the overlapping region in the outward direction is formed in the overlapping region, and a pad region having electrically conductive properties is formed in a region surrounding the through-hole in the substrate portion.

Abstract: An automated driving system of a vehicle includes a driver monitoring unit configured to perform at least one of monitoring a gaze of a driver and determining a position of a hand of the driver, an automated-driving-level switching unit configured to determine whether a transition of a driving control over the vehicle is required based on whether driving environment of the vehicle has changed during the vehicle being driven under control of the automated driving system, and determine an automated driving level to be switched based on a driver monitoring result obtained by the drive monitoring unit, and an automated driving control unit configured to control the vehicle according to the automated driving level.

Abstract: A solid electrolyte, including sulfide-based solid electrolyte particles and a coating layer disposed on the surface of the sulfide-based solid electrolyte particles and including a metal alkoxide.

Abstract: Provided is a Raman scattering measurement apparatus including a light source which emits light to smoke particles, a filter configured to block light which is incident to the smoke particles and passes through the particle and to allow Raman scattered light to pass therethrough, and a photodetector which detects the Raman scattered light passing through the filter in order to distinguish fire smoke generated due to a true fire from non-fire smoke generated due to daily life or industrial activity. The present invention also provides a fire determination apparatus including a unit which reads a Raman shift from Raman scattered light detected by the photodetector of the Raman scattering measurement apparatus, estimates a smoke component from the read Raman shift, and determines fire/non-fire from the estimated smoke component and a method thereof.

Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.

Abstract: A semiconductor memory device includes a first stacked structure, a first supporter layer, a second stacked structure, a block cut structure, and a second supporter layer on the second stacked structure and separated by a second cut pattern. The first stacked structure includes a first and second stack, the second stacked structure includes a third stack separated by the block cut structure and a fourth stack, the first supporter layer is on the first stack and the second stack, the second supporter layer is on the third stack and the fourth stack, the first cut pattern includes a first connection on the block cut structure and connecting the first supporter layer and the second stack, and the second cut pattern of the second supporter layer includes a second connection on the block cut structure and connecting the second supporter layer placed on the third stack and the fourth stack.

Abstract: The present disclosure relates to a high-entropy alloy and a manufacturing method therefor, and in particular, a high-entropy alloy and a manufacturing method therefor that comprises a multi-element alloy matrix and Cu, and comprises an alloy having a face-centered cubic (FCC)-based phase, such that the high-entropy alloy may have greater hardness and strength than an existing transition metal alloy while maintaining a FCC-based single phase, and has high lubricity.

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.

Abstract: An example electronic device includes a display, a communication circuit, a memory, and at least one processor configured to, based on a signal for requesting transmission of identification information including a call word for using first mode of an artificial intelligence assistant function of the electronic device being received, from another electronic device, through the communication circuit using first communication method, control the display to display a user interface for requesting user confirmation for transmission of the identification information; control the communication circuit to transmit the identification information to the another electronic device as a result of user confirmation through the user interface; and receive information for using a second communication method from the another electronic device.

Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.

Abstract: An antenna array architecture is provided for beamforming applications. The antenna array architecture facilitates a compact and wideband dual-polarized beam-switching antenna array architecture, which may be implemented in a cost-effective multi-layer PCB or package. The antenna array architecture is implemented as part of a package substrate having a number of layers. Each of the layers comprises various conductive elements such as conductive segments and/or traces that are disposed thereon in accordance with the respective antenna components.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the device including gate structures on a substrate; source/drain layers on portions of the substrate that are adjacent the gate structures, respectively; first contact plugs contacting upper surfaces of the source/drain layers, respectively; a second contact plug contacting one of the gate structures, a sidewall of the second contact plug being covered by an insulating spacer; and a third contact plug commonly contacting an upper surface of at least one of the gate structures and at least one of the first contact plugs, at least a portion of a sidewall of the third contact plug not being covered by an insulating spacer.

Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.

Abstract: An organic light emitting display apparatus including a substrate including a plurality of pixel areas; a pixel electrode on the substrate; an opposite electrode on the pixel electrode, the opposite electrode transmitting light; an organic light emitting layer between the pixel electrode and the opposite electrode, the organic light emitting layer emitting a first light toward the opposite electrode; a light emitting layer on the opposite electrode, the light emitting layer absorbing a portion of the first light and emitting a second light; and a sealing layer on the light emitting layer, the sealing layer sealing the pixel electrode, the opposite electrode, the organic light emitting layer, and the light emitting layer.

Abstract: There is provided a nonvolatile memory device having improved crack detection reliability. The nonvolatile memory device comprises word lines that extend in a first direction, cell contact plugs that are electrically connected to the word lines and extend in a second direction intersecting the first direction, a net crack detection circuit that is on the word lines and is not in contact with the word lines, and a ring crack detection circuit that is on the word lines and is not in contact with the word lines, wherein the net crack detection circuit is electrically connected to a crack detection transistor in a peripheral circuit region, the ring crack detection circuit includes a first crack detection metal wiring that extends in a third direction intersecting the first direction and the second direction, and a second crack detection metal wiring that extends in the third direction.

Abstract: An electronic device may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having first, second, and third lens elements. The first lens element may have a convex surface and a concave surface. The convex surface may have less curvature than the concave surface. An anti-reflective coating may be formed on the convex surface. A partially reflective mirror may be interposed between the first and second lens elements and a reflective polarizer may be interposed between the second and third lens elements. Alternatively, a partially reflective mirror may be interposed between the second and third lens elements and a reflective polarizer may be interposed between the first and second lens elements.

Abstract: Memory array structures, and methods of their formation, might include a first memory cell having a first control gate and an adjacent first portion of a charge-blocking structure, a second memory cell having a second control gate and an adjacent second portion of the charge-blocking structure, and a first dielectric material between the first control gate and the second control gate, and adjacent to a third portion of the charge-blocking structure that is between the first and second portions of the charge-blocking structure. The third portion of the charge-blocking structure might include a second dielectric material and a third dielectric material different than the second dielectric material, and the first portion of the charge-blocking structure and the second portion of the charge-blocking structure might each include the third dielectric material and a fourth dielectric material different than the second dielectric material. Apparatus might include such memory array structures.

Abstract: A display panel of a display device is divided into a first display region and a second display region. The second display region includes a boundary region adjacent to the first display region and a non-boundary region opposite to the first display region with respect to the boundary region. The driving controller outputs the voltage control signal, such that the first voltage in a first high voltage level and the second voltage in a first low voltage level are generated when the first display region is driven. The driving controller outputs the voltage control signal, such that the first voltage in a second high voltage level lower than the first high voltage level and the second voltage in a second low voltage level higher than the first low voltage level are generated, when the non-boundary region of the second display region is driven.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.