Abstract: Semiconductor devices having bonding wires are encapsulated in a fluid molding resin, and the flow front of the molding resin can displace the bonding wires and create a short of the device. A semiconductor IC device is provided with dummy bonding wires to prevent or reduce the wire displacement by blocking the remaining bonding wires from direct exposure to the molding resin flow front in the mold cavity. Wire displacement or sweep of the dummy bonding wires causes the dummy bonding wires to contact their adjacent remaining bonding wires, but this contact does not cause a short in the device. The size of the semiconductor IC device is thereby reduced by increasing the allowable length of the bonding wires in the device, resulting in improved yields and lower production costs.