Abstract: The present invention disclosed herein relates to a substrate treating apparatus and method. The substrate treating method includes: providing a substrate on which an oxide layer is formed; treating the oxide layer with a first process gas in a plasma state to substitute the treated oxide layer with a by-product layer; and heating the substrate to remove the by-product layer at a temperature which is above a first heating temperature at which the by-product layer is decomposed and is above a second heating temperature that is a boiling point of an additive by-product generated while the by-product layer is decomposed.

Abstract: Provided is an atmospheric plasma equipment and a waveguide for the same. The atmospheric plasma equipment according to this disclosure includes: an oscillator supplying an electromagnetic wave; and a waveguide into which the electromagnetic wave generated from the oscillator is input to be propagated therethrough, wherein the waveguide includes at least one or more steps, and plasma is generated at a waveguide region including a final short portion. The atmospheric plasma equipment may simultaneously attain an effect of causing concentration of an electromagnetic wave applied through the waveguide with one or more steps and an effect of stably maintaining generated plasma.

Abstract: Provided is an atmospheric plasma equipment and a waveguide for the same. The atmospheric plasma equipment according to this disclosure includes: an oscillator supplying an electromagnetic wave; and a waveguide into which the electromagnetic wave generated from the oscillator is input to be propagated therethrough, wherein the waveguide includes at least one or more steps, and plasma is generated at a waveguide region including a final short portion. The atmospheric plasma equipment may simultaneously attain an effect of causing concentration of an electromagnetic wave applied through the waveguide with one or more steps and an effect of stably maintaining generated plasma.

Abstract: Provided are an apparatus for normal pressure plasma ignition and a method for normal pressure plasma ignition using the same. The apparatus for normal pressure plasma ignition of the present invention comprises a wave guide tube wherein microwaves are applied, a dielectric tube that penetrates said wave guide tube and introduces a reactant gas, and an ignition apparatus for normal pressure plasma wherein microwaves are applied in said dielectric tube to turn said reactant gas into plasma, wherein said ignition apparatus penetrates said dielectric tube and includes an ignition rod that emits thermal electrons as said microwaves are applied in said dielectric tube. The apparatus for normal pressure plasma ignition according to the present invention enables ignition to be accomplished without power, so that the problems with the prior art that requires high voltage (excessive power, stability issues) may be avoided at the same time.

Abstract: Provided are an apparatus for gas scrubbing and a method for gas scrubbing. The apparatus for gas scrubbing includes: a reaction tube through which a reaction gas is flown in; a reactor which is connected to the reaction tube and activates the reaction gas with plasma; and a water injection port which injects water to the plasma in the reactor. It allows a very economical gas scrubbing because water is vaporized using the plasma as heat source, without using an additional heater. In addition, the efficiency of gas scrubbing is also improved because water is directly vaporized at an optimized region where the reaction gas in plasma state is discharged.