Patents by Inventor Youngcheol Kim

Youngcheol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200166254
    Abstract: A linear compressor is provided that may include a casing, a compressor body accommodated in the casing and defining a compression space for a refrigerant, a suction pipe coupled to a first side of the casing to supply the refrigerant to the compression space, a discharge pipe coupled to a second side of the casing to discharge the refrigerant compressed in the compression space outside of the casing, a process pipe coupled to the second side of the casing spaced apart from the discharge pipe to inject a refrigerant for supplement into the casing, and a separator that separates a mixed fluid of a refrigerant and oil injected through the process pipe.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Inventors: Kyeongweon LEE, Jeehyun KIM, Joonsung PARK, Byunghoon WOO, Youngcheol HAN
  • Publication number: 20200144666
    Abstract: A polymer solid electrolyte having high ion conductivity, heat resistance and dimensional stability, and having excellent oxidation stability and voltage stability, and a lithium secondary battery including the same.
    Type: Application
    Filed: April 12, 2018
    Publication date: May 7, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Youngcheol CHOI, Seungha KIM, Jonghyun CHAE, Kyoung Hoon KIM, Yeonju LEE, Daeil KIM, Lucia KIM
  • Publication number: 20200119301
    Abstract: A display device includes a organic light emitting device and an encapsulation structure disposed on the organic light emitting device that seals the organic light emitting device. The encapsulation structure includes a first inorganic encapsulation layer disposed on the organic light emitting device, an organic layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer disposed on the organic layer. The organic layer includes a first organic layer disposed on the first inorganic encapsulation layer and a second organic layer disposed on the first organic layer. An atomic ratio of carbon to silicon in the first organic layer is less than an atomic ratio of carbon to silicon in the second organic layer.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 16, 2020
    Inventors: Jaeheung Ha, Jongwoo Kim, Byoungduk Lee, Seungjae Lee, Yoonhyeung Cho, Youngcheol Joo
  • Patent number: 10584905
    Abstract: A linear compressor is provided that may include a casing, a compressor body accommodated in the casing and defining a compression space for a refrigerant, a suction pipe coupled to a first side of the casing to supply the refrigerant to the compression space, a discharge pipe coupled to a second side of the casing to discharge the refrigerant compressed in the compression space outside of the casing, a process pipe coupled to the second side of the casing spaced apart from the discharge pipe to inject a refrigerant for supplement into the casing, and a separator that separates a mixed fluid of a refrigerant and oil injected through the process pipe.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: March 10, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Kyeongweon Lee, Jeehyun Kim, Joonsung Park, Byunghoon Woo, Youngcheol Han
  • Patent number: 10529940
    Abstract: A display device includes a organic light emitting device and an encapsulation structure disposed on the organic light emitting device that seals the organic light emitting device. The encapsulation structure includes a first inorganic encapsulation layer disposed on the organic light emitting device, an organic layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer disposed on the organic layer. The organic layer includes a first organic layer disposed on the first inorganic encapsulation layer and a second organic layer disposed on the first organic layer. An atomic ratio of carbon to silicon in the first organic layer is less than an atomic ratio of carbon to silicon in the second organic layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: January 7, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jaeheung Ha, Jongwoo Kim, Byoungduk Lee, Seungjae Lee, Yoonhyeung Cho, Youngcheol Joo
  • Publication number: 20190393447
    Abstract: An organic light-emitting device includes a substrate, an organic light-emitting diode on the substrate, an encapsulation layer sealing the organic light-emitting diode, and an ultraviolet-reflective layer, the encapsulation layer including at least one inorganic layer and at least one organic layer that are alternately stacked, at least one selected from the at least one organic layer included in the encapsulation layer including an ultraviolet-absorbing material, and the ultraviolet-reflective layer consisting of an inorganic material.
    Type: Application
    Filed: January 29, 2019
    Publication date: December 26, 2019
    Inventors: Wonmin YUN, Yohan KIM, Yisu KIM, Eungseok PARK, Byoungduk LEE, Yoonhyeung CHO, Youngcheol JOO, Yongchan JU
  • Patent number: 10487814
    Abstract: A linear compressor is provided. The linear compressor may include a frame coupled to a cylinder, a gas hole defined in the frame, and a gas pocket that communicates with the gas hole and transfers a refrigerant gas to the cylinder.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: November 26, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Kyeongweon Lee, Changkyu Kim, Joonsung Park, Wonhyun Jung, Youngcheol Han
  • Publication number: 20190288235
    Abstract: A display device includes a display substrate including at least one step portion, and a thin film encapsulation layer above the display substrate, the thin film encapsulation layer including a buffer layer configured to reduce a height difference due to the at least one step portion and a barrier layer above the buffer layer, the buffer layer including a plurality of sub-layers and interfaces between the plurality of sub-layers, and the interfaces including a curved surface changing from a concave shape to a convex shape toward a portion overlapping the step portion from an outer portion of the step portion.
    Type: Application
    Filed: May 23, 2019
    Publication date: September 19, 2019
    Inventors: Minho Oh, Jongwoo Kim, Jiyoung Moon, Seungjae Lee, Yoonhyeung Cho, Youngcheol Joo, Jaeheung Ha
  • Publication number: 20190280332
    Abstract: A polymer solid electrolyte having high ion conductivity and interfacial stability. By the polymer solid electrolyte comprising an additive having excellent reachability to a positive electrode surface, and properties of facilitating film formation in a positive electrode due to low oxidation potential, a film is readily formed on the positive electrode surface, and as a result, a lithium secondary battery having enhanced performance may be provided.
    Type: Application
    Filed: April 13, 2018
    Publication date: September 12, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Seungha KIM, Youngcheol CHOI, Jonghyun CHAE, Kyoung Hoon KIM, Yeonju LEE, Daeil KIM, Lucia KIM
  • Patent number: 10347868
    Abstract: A display device includes a display substrate including at least one step portion, and a thin film encapsulation layer above the display substrate, the thin film encapsulation layer including a buffer layer configured to reduce a height difference due to the at least one step portion and a barrier layer above the buffer layer, the buffer layer including a plurality of sub-layers and interfaces between the plurality of sub-layers, and the interfaces including a curved surface changing from a concave shape to a convex shape toward a portion overlapping the step portion from an outer portion of the step portion.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: July 9, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Minho Oh, Jongwoo Kim, Jiyoung Moon, Seungjae Lee, Yoonhyeung Cho, Youngcheol Joo, Jaeheung Ha
  • Patent number: 10312473
    Abstract: An organic light emitting display device includes: a substrate; an organic light emitting element on the substrate; and a thin film encapsulation layer on the organic light emitting element. The thin film encapsulation layer includes a first thin film, a second thin film and a third thin film which are sequentially stacked therein, a refractive index of the second thin film is about 1.7 or greater, and a refractive index of the first thin film and a refractive index of the third thin film are greater than the refractive index of the second thin film by about 0.35 or greater.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Donghoon Kim, Dongchan Kim, Wonjong Kim, Wonmin Yun, Byoungduk Lee, Jihye Lee, Sanghoon Yim, Yoonhyeung Cho, Youngcheol Joo, Wonsuk Han
  • Publication number: 20170361768
    Abstract: Disclosed herein is a portable emergency sign device for a vehicle. The portable emergency sign device includes a box-shaped case body, a main laser oscillator, and a reflector. The box-shaped case body provides an installation space therein. The main laser oscillator is installed within the case body, and radiates laser light adapted to display the location region of a vehicle in trouble. The reflector is installed to be selectively projected out of and accommodated within the case body, and reflects the laser light, radiated by the main laser oscillator, onto a road surface.
    Type: Application
    Filed: July 8, 2016
    Publication date: December 21, 2017
    Inventor: Youngcheol KIM
  • Patent number: 9125332
    Abstract: A semiconductor package includes a semiconductor die with a plurality of solder bumps formed on bump pads. A substrate has a plurality of contact pads each with an exposed sidewall. A solder resist is disposed opening over at least a portion of each contact pad. The solder bumps are reflowed to metallurgically and electrically connect to the contact pads. Each contact pad is sized according to a design rule defined by SRO+2*SRR?2X, where SRO is the solder resist opening, SRR is a solder registration for the manufacturing process, and X is a function of a thickness of the exposed sidewall of the contact pad. The value of X ranges from 5 to 20 microns. The solder bump wets the exposed sidewall of the contact pad and substantially fills an area adjacent to the exposed sidewall. The contact pad can be made circular, rectangular, or donut-shaped.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: September 1, 2015
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Rajendra D. Pendse, Youngcheol Kim, TaeKeun Lee, GuiChea Na, GwangJin Kim
  • Patent number: 8841782
    Abstract: An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: September 23, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventors: DaeWook Yang, Youngcheol Kim, Tae Keun Lee
  • Patent number: 8604602
    Abstract: A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling stacking interconnects on the component side; and forming an integrated circuit receptacle, for receiving an integrated circuit device, by molding a reinforced encapsulant on the component side and exposing a portion of the stacking interconnects.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: December 10, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: Seng Guan Chow, Il Kwon Shim, Heap Hoe Kuan, Youngcheol Kim
  • Patent number: 8481371
    Abstract: A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: July 9, 2013
    Assignee: STATS Chippac Ltd.
    Inventors: Youngcheol Kim, Myung Kil Lee, Gwang Kim, Koo Hong Lee
  • Patent number: 8410594
    Abstract: An inter-stacking module system is provided by mounting an integrated circuit on a first substrate, the first substrate having a first bond pad, mounting an inter-stacking module substrate over the integrated circuit, forming an inter-stacking module bonding pad on the inter-stacking module substrate, and connecting bond wires between the inter-stacking module bonding pad and the first bond pad.
    Type: Grant
    Filed: January 11, 2006
    Date of Patent: April 2, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: Kwang Soon Hwang, Youngcheol Kim, Hun Teak Lee, Koo Hong Lee
  • Patent number: 8102043
    Abstract: A method for manufacturing a stacked integrated circuit and package system includes: attaching a high temperature resistant layer on a top substrate; mounting a first top integrated circuit on the high temperature resistant layer; mounting a second top integrated circuit on the first top integrated circuit; molding an encapsulant over the first top integrated circuit, the second top integrated circuit and the top substrate; mounting a third top integrated circuit over the first top integrated circuit on a surface opposite the second top integrated circuit; mounting a fourth top integrated circuit on the third top integrated circuit; molding an encapsulant over the third top integrated circuit, the fourth top integrated circuit and the top substrate; forming top electrical connectors on a lower surface of the top substrate; and mounting a bottom package to the top electrical connectors.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: January 24, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Tae Sung Jeong, Hyeog Chan Kwon, Youngcheol Kim
  • Publication number: 20110215456
    Abstract: A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
    Type: Application
    Filed: May 20, 2011
    Publication date: September 8, 2011
    Inventors: Youngcheol Kim, Myung Kil Lee, Gwang Kim, Koo Hong Lee
  • Patent number: 7947535
    Abstract: A thin package system with external terminals and a leadframe is provided. An external bond finger defining template is provided and used to form external bond fingers on the leadframe. A die is provided and attached to the leadframe. At least portions of the die and the external bond fingers are encapsulated, and the leadframe is removed.
    Type: Grant
    Filed: October 22, 2005
    Date of Patent: May 24, 2011
    Assignee: STATS ChipPAC Ltd.
    Inventors: Youngcheol Kim, Myung Kil Lee, Gwang Kim, Koo Hong Lee