Abstract: A memory package includes a package substrate including a redistribution layer and bonding pads connected to the redistribution layer, the redistribution layer including a plurality of signal paths; a buffer chip mounted on the package substrate and including a plurality of chip pads corresponding to a plurality of memory channels; and a plurality of memory chips stacked on the package substrate and divided into a plurality of groups corresponding to the plurality of memory channels, wherein memory chips of a first group, among the plurality of memory chips, are connected to first chip pads of the plurality of chip pads through first wires, and wherein memory chips of a second group, among the plurality of memory chips, are connected to second chip pads of the plurality of chip pads through second wires and at least a portion of the plurality of signal paths.

Abstract: Provided is a neural processing device including a noise classifier configured to perform a preprocessing on input data to determine a noise characteristic of the input data, a network selector configured to select one of a plurality of neural networks based on the noise characteristic, and an operator configured to perform inference on the input data based on selected weights corresponding to the selected neural network.