Abstract: The present invention relates to a method for manufacturing copper nanoparticles, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes preparing a mixture solution including a copper salt, a dispersing agent, a reducing agent and an organic solvent; raising temperature of the mixture solution up to 30-50° C. and agitating; irradiating the mixture solution with microwaves; and obtaining the copper nanoparticles by lowering temperature of the mixture solution. According to the present invention, several tens of nm of copper nanoparticles having a narrow particle size distribution and good dispersibility can be synthesized in mass production.

Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.

Abstract: The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.

Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.

Abstract: The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.

Abstract: The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property.

Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.

Abstract: Nickel nanoparticles including an aqueous solution including a nickel precursor, a surfactant, a hydrophobic solvent, and distilled water, the hydrophobic solvent being one or more compounds selected from the group consisting of hexane, cyclohexane, heptane, octane, isooctane, decane, tetradecane, hexadecane, toluene, xylene, 1-octadecene, and 1-hexadecene; a compound including hydrazine which is added to the aqueous solution to form a nickel-hydrazine complex; and a reducing agent added to the compound including the nickel-hydrazine complex.

Abstract: Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method.

Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.

Abstract: A method of manufacturing nickel nanoparticles and nickel nanoparticles thus produced, having superior dispersion stability and smooth surface, by reducing after forming nickel-hydrazine complex in a reverse microemulsion, where the method includes forming an aqueous solution including nickel precursor, surfactant, and hydrophobic solvent, forming nickel-hydrazine complex by adding a reducing agent that includes hydrazine to the mixture, and producing nickel nanoparticles by adding a reducing agent to the mixture that includes the nickel-hydrazine complex.

Abstract: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board having a circuit pattern formed therein includes a substrate having a groove formed therein, the groove corresponding to the circuit pattern; a first circuit pattern formed inside the groove; and a second circuit pattern formed on the first circuit pattern, the second circuit pattern filling up the groove.

Abstract: An apparatus for manufacturing metal nanoparticles is disclosed. The apparatus includes: a precursor supply unit configured to supply a precursor solution for metal nanoparticles, a transport device configured to transport the precursor solution, a heating unit connected with the precursor supply unit and configured to heat the precursor solution to a temperature range in which a production of metal nanoparticles occurs, and a cooling unit connected with the heating unit and configured to collect and cool metal nanoparticles produced at the heating unit, where the cooling unit includes: a channel, a tube surrounding the channel, and a circulator configured to supply a coolant to the tube.

Abstract: The present invention relates to a method for manufacturing nickel nanoparticles and more particularly to a method including preparing a mixture solution by adding a reducing agent, a dispersing agent and a nickel salt to a polyol; stirring and heating the mixture solution; and producing nickel nanoparticles by reacting the mixture solution, so that it allows mass production of nickel nanoparticles having uniformity of size 30 to 50 nm and high dispersibility.

Abstract: The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.

Abstract: The present invention relates to a method for manufacturing copper nanoparticles and copper nanoparticles thus manufactured, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes producing mixture by mixing one or more copper salt selected from a group consisting of CuCl2, Cu(NO3)2, CuSO4, (CH3COO)2Cu and Cu(acac)2 (copper acetyloacetate) with fatty acid and dissociating; and reacting the mixture by heating and copper nanoparticle. According to the present invention, copper nanoparticles can be synthesized in a uniform size and a high concentration using general copper salt as a copper precursor material in non-aqueous system without designing precursor material. The present invention is not only environment-friendly, but also economical as highly expensive equipment is not demanded.

Abstract: The present invention relates to a method for manufacturing copper nanoparticles, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes preparing a mixture solution including a copper salt, a dispersing agent, a reducing agent and an organic solvent; raising temperature of the mixture solution up to 30-50° C. and agitating; irradiating the mixture solution with microwaves; and obtaining the copper nanoparticles by lowering temperature of the mixture solution. According to the present invention, several tens of nm of copper nanoparticles having a narrow particle size distribution and good dispersibility can be synthesized in mass production.

Abstract: The invention provides a method of manufacturing nickel nanoparticles and nickel nanoparticles thus produced, having superior dispersion stability and smooth surface, by reducing after forming nickel-hydrazine complex in a reverse microemulsion, wherein the method includes (a) forming an aqueous solution including nickel precursor, surfactant, and hydrophobic solvent, (b) forming nickel-hydrazine complex by adding a reducing agent that includes hydrazine to the mixture, (c) producing nickel nanoparticles by adding an reducing agent to the mixture that includes said nickel-hydrazine complex.

Abstract: A method of producing metal nanoparticles, having a high yield rate achieved by a simple heat-treatment of a metal alkanoate. The method of the invention is not only environment-friendly as it does not require additional solvents or supplements, but also economical as highly expensive equipment is not demanded. In addition, the invention provides metal nanoparticles having uniform shape and distribution, and provides conductive ink including the metal nanoparticles thus obtained. One aspect may provide a method of (a) producing a metal alkanoate by reacting a metal precursor with an alkanoate of alkali metals, alkaline earth metals or ammonium in an aqueous solution (b) filtrating and drying the metal alkanoate, and (c) heat-treating the metal alkanoate of (b).

Abstract: A method of producing hydrophobic metal nanoparticles using a hydrophobic solvent, having uniform particle size distribution and high yield rate to allow mass production; the metal nanoparticles thus produced; and conductive ink including the metal nanoparticles are disclosed. According to one aspect of the invention, a method of producing metal nanoparticles is provided, comprising dissociating a metal compound with an amine-based compound, and adding a hydrocarbon-based compound and either one of an alkanoic acid or a thiol-based compound to the dissociated metal ion solution.