Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

Abstract: Provided is a substrate processing apparatus and a substrate processing method that are capable of increasing exhaust volume without increasing exhaust facilities. An apparatus for processing a substrate includes: a processing chamber having a processing space for processing a substrate; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a liquid to a substrate supported by the support unit; and an exhaust unit for exhausting the processing space, in which the exhaust unit includes: an exhaust pipe connected to the processing space; and an exhaust amplifier installed in the exhaust pipe and for supplying acceleration gas to a passage of the exhaust pipe to amplify an exhaust flow rate of exhaust gas flowing in the exhaust pipe.

Abstract: A method for monitoring performance of an eccentricity correction unit, the method includes a first operation of measuring eccentricity of a substrate mounted on a support unit and storing an amount of eccentricity correction corrected by the eccentricity correction unit such that measured eccentricity of the substrate is within a preset allowable eccentricity value, and a second operation of monitoring, based on the stored amount of eccentricity correction, performance degradation of the eccentricity correction unit.

Abstract: A substrate processing apparatus includes a support unit supporting a substrate, a rear nozzle unit installation unit including a sidewall surrounding the support unit and forming an internal space, a rear nozzle unit including a rear nozzle movably disposed outside of the sidewall to supply liquid toward a rear surface of the substrate and a rear nozzle driving unit connected to the rear nozzle through a partial sidewall portion of the sidewall in the internal space and driving the rear nozzle to move, and a liquid inflow preventing unit disposed on the partial sidewall portion of the sidewall and including an isolation space isolated from the internal space.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chuck supporting a substrate; a liquid supply unit configured to supply a liquid to a substrate supported on the chuck; a treating container surrounding the substrate supported on the chuck; and an eccentricity correction unit configured to correct an eccentricity of the substrate supported on the chuck, and wherein the eccentricity correction unit contacts a plurality of points on a side end of the substrate supported on the chuck to match a center of the substrate with a center of the chuck.

Abstract: Proposed are a substrate processing apparatus and a substrate processing method capable of efficiently preventing contamination of a substrate and a processing space caused by a reverse flow of purge gas.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.

Abstract: A substrate processing apparatus includes a nozzle unit including a nozzle tip discharging liquid to a substrate; and a liquid supply line supplying the liquid to the nozzle unit, wherein the liquid supply line includes a liquid supply pipe connected to the nozzle tip; a supply valve installed in the liquid supply pipe; and a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe.

Abstract: An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

Abstract: A chemical liquid supply unit includes a chemical liquid storage storing a chemical liquid, a chemical liquid supply line that is connected to the chemical liquid storage, the chemical liquid flowing through the chemical liquid supply line from the chemical liquid storage, and a chemical liquid inspection means detecting impurities from the chemical liquid flowing through the chemical liquid supply line using a spectroscopy method.

Abstract: The substrate treating apparatus includes a liquid supply unit for supplying a treating liquid to a substrate supported by a support unit, the liquid supply unit includes a nozzle member for discharging the treating liquid; and a driving member for moving the nozzle member to a standby position and a process position, the nozzle member includes a body having a buffer space and a discharge port configured to discharge the treating liquid; and a rotation member for changing the body between a first state and a second state by a rotation, the first state is a state at which a treating liquid filled in the buffer space is maintained so the treating liquid does not flow to the discharge port, and the second state is a state at which the treating liquid filled in the buffer space is discharged to an outside of the body through the discharge port.

Abstract: An apparatus for constructing a library for deriving a material composition using empirical result, which enables acceleration of research on the material-properties relationship. By applying the empirical results of the material composition, missing data of the material compositions can be statistically calculated by using supervised non-linear imputation techniques. The completed composition information of the materials is passed as an input of machine learning material-properties relationship prediction.

Abstract: The present invention relates to a cushion device utilized for a bed, sofa, chair, or seat for a vehicle. The cushion device comprises an outer supporting member (20) having a shock absorbing space (10) and a cushion plate (30) to be elastically installed on the outer supporting member (20). The cushion device of the present invention comfortably accommodates a human body, and has long life.