Abstract: An electronic apparatus includes: a housing including a coupling region; and a printed circuit board (PCB) including: an overlap region that overlaps the coupling region; a non-overlap region that does not overlap the coupling region; a plurality of metal layers including a plurality of lines; and a void portion in which a portion of at least one metal layer, among the plurality of metal layers, is not formed so that the at least one metal layer is discontinuous or terminated in the void portion, the at least one metal layer including a metal layer that is closest to the coupling region among the plurality of metal layers.

Abstract: According to various embodiments, an electronic device may include: a communication processor, a radio frequency (RF) integrated circuit (RFIC) configured to receive a signal output from the communication processor and to modulate the signal into an RF signal, a power management circuit, a first power amplifier configured to amplify an RF signal output from the RFIC based on power supplied from the power management circuit, a second power amplifier configured to amplify the RF signal output from the RFIC based on the power supplied from the power management circuit, at least one capacitor connected in parallel to a power supply terminal of the first power amplifier, and at least one switch connected between the power supply terminal and the at least one capacitor, wherein the communication processor is configured to: identify a power amplification mode based a frequency band of the RF signal, and control the at least one switch by outputting a control signal corresponding to the identified power amplification