Patents by Inventor Young Ki Ko

Young Ki Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for filling a wafer via with solder
    Patent number: 10115635
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: October 30, 2018
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko
  • METHOD FOR FILLING A WAFER VIA WITH SOLDER
    Publication number: 20180301377
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Application
    Filed: February 3, 2017
    Publication date: October 18, 2018
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo LEE, Jun Ki KIM, Jeong Han KIM, Young Ki KO
  • APPARATUS AND METHODS FOR FILLING A WAFER VIA WITH SOLDER
    Publication number: 20170148678
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Application
    Filed: February 3, 2017
    Publication date: May 25, 2017
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo LEE, Jun Ki KIM, Jeong Han KIM, Young Ki KO
  • Apparatus for filling a wafer via with solder
    Patent number: 9603254
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: March 21, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko
  • APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME
    Publication number: 20140123488
    Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
    Type: Application
    Filed: July 10, 2012
    Publication date: May 8, 2014
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Sehoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko
  • Device of filling metal in through-via-hole of semiconductor wafer and method using the same
    Patent number: 8486827
    Abstract: A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: July 16, 2013
    Assignee: Korea Institute of Industrial Technology
    Inventors: Se Hoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Cheol Hee Kim, Young Ki Ko, Yue Seon Shin
  • DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME
    Publication number: 20120034776
    Abstract: A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.
    Type: Application
    Filed: December 30, 2009
    Publication date: February 9, 2012
    Inventors: Se Hoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Cheol Hee Kim, Young Ki Ko, Yue Seon Shin