Patents by Inventor Young-lae CHO

Young-lae CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package of light emitting diode with heat sink
    Patent number: 9356005
    Abstract: Disclosed herein is a light emitting diode (LED) package. The present invention is directed to a light emitting diode (LED) package capable of efficiently dissipating heat generated from LEDs. The present invention is also directed to a LED package in which a plurality of LEDs are disposed and heat generated from the plurality of LEDs is efficiently dissipated.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: May 31, 2016
    Assignee: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Su-jeong Suh, Hwa-sun Park, Jung-kab Park, Tae-yoo Kim, Young-lae Cho, Mi-ri Lee, Jin-ha Shin, Hwa-jin Son, Jung-woo Lee
  • LED PACKAGE
    Publication number: 20150348950
    Abstract: Disclosed herein is a light emitting diode (LED) package. The present invention is directed to a light emitting diode (LED) package capable of efficiently dissipating heat generated from LEDs. The present invention is also directed to a LED package in which a plurality of LEDs are disposed and heat generated from the plurality of LEDs is efficiently dissipated.
    Type: Application
    Filed: May 27, 2015
    Publication date: December 3, 2015
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Su-jeong SUH, Hwa-sun PARK, Jung-kab PARK, Tae-yoo KIM, Young-lae CHO, Mi-ri LEE, Jin-ha SHIN, Hwa-jin SON, Jung-woo LEE
  • SUBSTRATE FOR LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME AND LIGHT SOURCE APPARATUS INCLUDING THE SUBSTRATE
    Publication number: 20150200343
    Abstract: A substrate for a light emitting diode (LED) and a method of manufacturing the substrate for the LED are provided. The substrate for the LED includes a conductive substrate which includes an upper surface including a first flat surface and a second flat surface stepped from the first flat surface, an insulating layer formed on the second flat surface, and an electrode layer spaced apart from the first flat surface and disposed on the insulating layer.
    Type: Application
    Filed: January 13, 2015
    Publication date: July 16, 2015
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Su-jeong SUH, Hwa-sun PARK, Jung-kab PARK, Young-lae CHO, Tae-yoo KIM, Jae-hoon SHIN, Jin-ha SHIN, Jung-woo LEE, Hwa-jin SON, Jung-ho PARK