Abstract: A circuit board mounting system in one example comprises an improved mounting system for a circuit board disposed between housing elements, wherein the improvement comprises a plurality of slots formed in the circuit board and a plurality of bushings disposed within the slots, such that the housing elements rest on opposed ends of the bushings, and the circuit board moves in a plane substantially parallel to its mounting surfaces in response to changes in temperature, thus reducing thermal stress.

Abstract: A packaging system in one example comprises an improved mechanical packaging system for a circuit board disposed between housing elements, the improvement comprising an upper housing member having a centrally disposed opening provided therethrough, a unitary electromagnetic shield disposed on at least an upper surface of the circuit board and secured to the circuit board, the unitary electromagnetic shield secured to the upper housing member, such that undesired mechanical vibration modes are substantially reduced.

Abstract: An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.

Abstract: A novel Fabry-Perot resonance cavity has been recognized. This cavity is formed by simple planar and concave (or two concave) mirrors—attached at the fiber ends. The concave mirror is precisely aligned to the core of the fiber. The concave lens is fabricated on the end of the fiber by making an indentation of correct geometry and smoothness. The concave mirror has multiple dielectric layers applied on the concave lens to achieve the final, desired optical characteristics.

Abstract: An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.

Abstract: A rotation sensor is formed of three semiconductor wafers. A first wafer comprises a frame that surrounds a paddle. The rotation-sensitive paddle is surrounded on either of the opposed sides of the first wafer by rings of driven elements formed of radially-directed plateaus in the semiconductor material. Second and third wafers sandwich the first wafer. Each of the second and third wafers includes a first surface in which are formed concentric rings of driver and pickoff electrodes. In a preferred embodiment, the rings of pickoff electrodes are split into two semicircular arcs.

Abstract: An input optical fiber (22), an output optical fiber (24, 26) and a waveguide (14) in an integrated optic chip (IOC) (12) intermediate the fibers are coupled together using service and alignment robots (42; 48, 50, 52). The service robot (42) establishes the three dimensional position of the waveguide. The alignment robots (48, 50, 52) three dimensionally and angularly align the input and output fibers respectively to the input and output legs (16; 18, 20) of the waveguide. An adhesive applying tool (46) coupled with the service robot adheres the input and output fibers respectively to their waveguide input and output legs.