Abstract: The present disclosure relates to an automatic metal sorting system using laser induced breakdown spectroscopy. The system may include: a conveyer configured to move waste metals at a constant speed; a shape measurer configured to measure a position and a shape of at least one waste metal on the conveyer; a laser induced breakdown spectroscopic device configured to determine the kind of the waste metal by emitting a laser to the waste metal and receiving and analyzing a plasma spectrum signal generated by the emitted laser; and a discharger configured to separate and discharge the waste metal in accordance with the determined kind of the waste metal.

Abstract: A heat storage body for a regenerative catalytic apparatus is provided, the heat storage body includes: a body unit including a ceramic sintered body containing aluminum oxide, silica, and magnesium oxide, the body unit having a plurality of channels connecting first and second surfaces, located opposite to each other. The heat storage body further including a protective film disposed on a surface of the body unit and inner surfaces of the plurality of channels. The protective film includes an oxide containing a first metal of aluminum and at least one second metal including at least one from among yttrium, zinc, zirconium, tungsten, zinc, and nickel.

Abstract: A method for manufacturing a display device according to an embodiment includes forming a first light emitting material layer on a substrate; forming a first photosensitive pattern on the first light emitting material layer; and forming a first emission layer according to a first dry etching process with the first photosensitive pattern as a mask, wherein the forming of a first photosensitive pattern includes irradiating vacuum ultraviolet rays to a photosensitive material layer.

Abstract: A lighting device according to an embodiment comprises a substrate, a light emitting device disposed on the substrate, a first reflective member disposed on the substrate, a resin layer disposed on the first reflective member, and a wavelength conversion layer disposed on the resin layer, wherein the resin layer includes a first resin layer, a second resin layer spaced apart from the first resin layer, and a third resin layer disposed between the first and second resin layers; the wavelength conversion layer includes a first wavelength conversion layer disposed on the first resin layer and a second wavelength conversion layer disposed on the second resin layer, and the height of the second resin layer is different from the height of the first resin layer; and the light emitting device may be disposed in a region vertically overlap the second and third resin layers but vertically overlap the first layer.

Abstract: A deposition device may include a substrate supporter that supports a substrate; a source supply part that supplies a deposition material to the substrate; a deposition mask positioned between the substrate and the source supply part; and a light supply part that is detachably disposed or detachable to face the substrate via the deposition mask between the substrate and the light supply part.

Abstract: The present disclosure relates to an automatic metal sorting system using laser induced breakdown spectroscopy. The system may include: a conveyer configured to move waste metals at a constant speed; a shape measurer configured to measure a position and a shape of at least one waste metal on the conveyer; a laser induced breakdown spectroscopic device configured to determine the kind of the waste metal by emitting a laser to the waste metal and receiving and analyzing a plasma spectrum signal generated by the emitted laser; and a discharger configured to separate and discharge the waste metal in accordance with the determined kind of the waste metal.

Abstract: A substrate-treating apparatus includes a liquid-providing part, a first liquid-removing knife and a returning part. The liquid-providing part provides a first liquid chemical for cleaning a substrate that includes a metal pattern and a photoresist pattern on the metal pattern, and for removing an etchant that remains on the substrate. The first liquid-removing knife sprays a second liquid chemical in a direction inclined and opposite to a returning direction of the substrate, so as to remove the first liquid chemical, the first liquid chemical including a metal precipitate. The returning part returns the substrate from the liquid-providing part toward the first liquid-removing knife in the returning direction.

Abstract: A method of providing a chat service between a first device and a plurality of second devices, includes: creating a first chat room configured to display visual signs transmitted and received between the first device and the plurality of second devices; receiving a command to select one or more of the plurality of second devices while the first chat room is displayed on the first device; selecting the one or more of the plurality of second devices based on the command; and creating a second chat room configured to display visual signs transmitted and received between the first device and the selected one or more of the plurality of second devices.

Abstract: A method of providing a chat service includes: sequentially displaying, on a display unit of a first device, a plurality of visual signs according to at least one of transmission and reception times of the plurality of visual signs, the plurality of visual signs being included in a conversation between the first device and one or more second devices, and being transmitted between the first device and the one or more second devices; receiving an edit mode entry command to enter an edit mode in which the plurality of visual signs are editable; receiving a visual sign selection command selecting one or more of the plurality of visual signs; and changing a display order of the plurality of visual signs by moving the selected one or more of the plurality of visual signs.

Abstract: A thin film transistor array panel includes: a gate line on a substrate and including a gate electrode; a first gate insulating layer on the substrate and the gate line, the first gate insulting layer including a first portion adjacent to the gate line and a second portion overlapping the gate line and having a smaller thickness than that of the first portion; a second gate insulating layer on the first gate insulating layer; a semiconductor layer on the second gate insulating layer; a source electrode and a drain electrode spaced apart from each other on the semiconductor layer; a passivation layer on the second gate insulating layer, the source electrode and the drain electrode; and a pixel electrode on the passivation layer and connected with the drain electrode. The first gate insulating layer and the second gate insulating layer have stress in opposite directions from each other.

Abstract: A thin film transistor array panel includes: a gate line on a substrate and including a gate electrode; a first gate insulating layer on the substrate and the gate line, the first gate insulting layer including a first portion adjacent to the gate line and a second portion overlapping the gate line and having a smaller thickness than that of the first portion; a second gate insulating layer on the first gate insulating layer; a semiconductor layer on the second gate insulating layer; a source electrode and a drain electrode spaced apart from each other on the semiconductor layer; a passivation layer on the second gate insulating layer, the source electrode and the drain electrode; and a pixel electrode on the passivation layer and connected with the drain electrode. The first gate insulating layer and the second gate insulating layer have stress in opposite directions from each other.

Abstract: One embodiment comprises first and second light-emitting chips, each comprising: a package body having a cavity; first to fourth lead frames disposed inside the package body; a first semiconductor layer; an active layer; and a second semiconductor layer and emitting light of a different wavelength from each other, wherein each of the first to fourth lead frames comprises: an upper surface part exposed to the cavity; and a side surface part bent from one side portion of the upper surface part and exposed by one surface of the package body. In addition, the first light-emitting chip is disposed on the upper surface part of the first lead frame, and the second light-emitting chip is disposed on the upper surface part of the third lead frame.

Abstract: A method of providing a chat service includes: sequentially displaying, on a display unit of a first device, a plurality of visual signs according to at least one of transmission and reception times of the plurality of visual signs, the plurality of visual signs being included in a conversation between the first device and one or more second devices, and being transmitted between the first device and the one or more second devices; receiving an edit mode entry command to enter an edit mode in which the plurality of visual signs are editable; receiving a visual sign selection command selecting one or more of the plurality of visual signs; and changing a display order of the plurality of visual signs by moving the selected one or more of the plurality of visual signs.

Abstract: A method of providing a chat service between a first device and a plurality of second devices, includes: creating a first chat room configured to display visual signs transmitted and received between the first device and the plurality of second devices; receiving a command to select one or more of the plurality of second devices while the first chat room is displayed on the first device; selecting the one or more of the plurality of second devices based on the command; and creating a second chat room configured to display visual signs transmitted and received between the first device and the selected one or more of the plurality of second devices.

Abstract: A liquid crystal display includes: a substrate; a gate line and a data line disposed on the substrate; a semiconductor layer disposed on the substrate; first and second field generating electrodes disposed on the substrate; and a first protecting layer formed from the same layer as the first field generating electrode and covering at least a portion of the data line.

Abstract: A substrate-treating apparatus includes a liquid-providing part, a first liquid-removing knife and a returning part. The liquid-providing part provides a first liquid chemical for cleaning a substrate that includes a metal pattern and a photoresist pattern on the metal pattern, and for removing an etchant that remains on the substrate. The first liquid-removing knife sprays a second liquid chemical in a direction inclined and opposite to a returning direction of the substrate, so as to remove the first liquid chemical, the first liquid chemical including a metal precipitate. The returning part returns the substrate from the liquid-providing part toward the first liquid-removing knife in the returning direction.

Abstract: A thin film transistor includes a gate electrode, an active pattern overlapping with the gate electrode and including a semiconductive oxide, and a source metal pattern disposed on the active pattern and including a source electrode and a drain electrode spaced apart from the source electrode. The active pattern underlaps an entire portion of a lower surface of the source metal pattern and minimally protrudes beyond lateral ends of the source metal pattern due to the active pattern having sidewall taper angles that are substantially greater than corresponding and adjacent sidewall taper angles of the overlying source metal pattern. Thus parasitic capacitance may be reduced and performance enhanced.

Abstract: A method of forming a metal pattern includes disposing a gate metal layer on a substrate; disposing a photoresist layer on the gate metal layer; etching portions of the photoresist layer to form a first photo pattern; etching portions of the gate metal layer to form a gate pattern including a gate electrode, in which the gate metal layer is patterned using the first photo pattern as a mask; ashing an end portion of the first photo pattern to form a second photo pattern; disposing a first gate insulating layer over the substrate and the second photo pattern; removing the second photo pattern and a portion of the first gate insulating layer disposed over the second photo pattern; and disposing a second insulating layer over the gate pattern and the remaining portions of the first gate insulating layer.

Abstract: A method of forming a metal pattern includes disposing a gate metal layer on a substrate; disposing a photoresist layer on the gate metal layer; etching portions of the photoresist layer to form a first photo pattern; etching portions of the gate metal layer to form a gate pattern including a gate electrode, in which the gate metal layer is patterned using the first photo pattern as a mask; ashing an end portion of the first photo pattern to form a second photo pattern; disposing a first gate insulating layer over the substrate and the second photo pattern; removing the second photo pattern and a portion of the first gate insulating layer disposed over the second photo pattern; and disposing a second insulating layer over the gate pattern and the remaining portions of the first gate insulating layer.

Abstract: Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame.