Patents by Inventor Youngrok KWON

Youngrok KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250234502
    Abstract: A semiconductor device manufacturing method includes forming a cell gate structure in a substrate comprising a cell area and a peripheral circuit area; forming bit line structures on the cell area; forming a peripheral structure comprising a peripheral gate structure on the peripheral circuit area; forming a semiconductor material layer covering the bit line structures and the peripheral structure; and forming a contact plug between the bit line structures by laser annealing the semiconductor material layer using a laser beam. Forming the contact plug includes crystallizing an upper portion of the semiconductor material layer by performing a primary laser annealing process to form a first preliminary crystal layer; crystallizing a lower portion of the semiconductor material layer by performing a secondary laser annealing process to form a second crystal layer; and removing an upper portion of the first preliminary crystal layer to form a first crystal layer.
    Type: Application
    Filed: November 14, 2024
    Publication date: July 17, 2025
    Inventors: Seongkeun Cho, Songyun Kang, Youngrok Kwon, Youngseok Kim, Yihwan Kim, Kisoo Park, Kyeongmin Cho, Suhwan Hwang
  • Publication number: 20250022693
    Abstract: An electrostatic chuck may include a body, a body; an internal electrode in the body, wherein the internal electrode is configured to generate an electrostatic force when a voltage is applied to the internal electrode; and a coating layer on an outer surface of the body, wherein the coating layer comprises a film forming material including a silicon-containing material.
    Type: Application
    Filed: January 31, 2024
    Publication date: January 16, 2025
    Inventors: Iksu BYUN, Songyun KANG, Youngrok KWON
  • Publication number: 20240162017
    Abstract: A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. The cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Heewon MIN, Juho KIM, Dongyun YEO, Kuihyun YOON, Seungbin LIM, Songyun KANG, Youngrok KWON