Abstract: A launch pad system includes a fuel vent port provided in a launch vehicle, a launch pad fuel tank provided outside the launch vehicle to store fuel, a fuel recovery line connecting the fuel vent port and the launch pad fuel tank such that the fuel is transferred therethrough, and a fuel transfer unit provided on the fuel recovery line to transfer the fuel, wherein the fuel may be recovered from the launch vehicle to the launch pad fuel tank.

Abstract: An ion filter for circulating coolant in a fuel cell stack of a fuel cell vehicle includes a housing including an inlet configured so that a fluid is introduced and an outlet configured so that the fluid is discharged, a filter element accommodated in the housing to filter the fluid, a valve assembly provided on the inlet and configured to operate the flow of the fluid introduced into the housing through the inlet to be allowed or blocked, and a gate member provided in the housing and configured to adjust an operation of the valve assembly.

Abstract: An embodiment solid electrolyte includes a first compound and a second compound. The first compound is represented by a first chemical formula Li7-aPS6-a(X11-bX2b)a, wherein X1 and X2 are the same or different and each represents F, Cl, Br, or I, and wherein 0<a?2 and 0<b<1, and the second compound is represented by a second chemical formula Li7-cP1-2dMdS6-c-3d(X11-eX2e)c, wherein X1 and X2 are the same or different and each represents F, Cl, Br, or I, wherein M represents Ge, Si, Sn, or any combination thereof, and wherein 0<c?2, 0<d<0.5, and 0<e<1.

Abstract: An organic light emitting display apparatus including a substrate including a plurality of pixel areas; a pixel electrode on the substrate; an opposite electrode on the pixel electrode, the opposite electrode transmitting light; an organic light emitting layer between the pixel electrode and the opposite electrode, the organic light emitting layer emitting a first light toward the opposite electrode; a light emitting layer on the opposite electrode, the light emitting layer absorbing a portion of the first light and emitting a second light; and a sealing layer on the light emitting layer, the sealing layer sealing the pixel electrode, the opposite electrode, the organic light emitting layer, and the light emitting layer.

Abstract: Provided are a method and an apparatus for measuring an endolymphatic hydrops ratio of inner ear organs using an artificial neural network. The method of measuring an endolymphatic hydrops ratio includes obtaining a plurality of frame images obtained by capturing inner ear organs, obtaining a plurality of pieces of mask data corresponding to each of the plurality of frame images by inputting the plurality of frame images into a neural network, clustering the plurality of pieces of mask data according to the inner ear organs and obtaining representative images according to the inner ear organs according to certain conditions, and overlapping a target image synthesized by using the plurality of frame images and the representative images according to the inner ear organs so as to measure an endolymphatic hydrops ratio.

Abstract: A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected to the semiconductor chip, a thermal conductive layer disposed on the second surface of the semiconductor chip, a sealing layer surrounding a side surface of the semiconductor chip and a side surface of the thermal conductive layer, and a second redistribution portion disposed on the sealing layer, the second redistribution portion including a first upper wiring layer connected to the thermal conductive layer, the second redistribution portion including a second upper wiring layer electrically connected to the semiconductor chip.

Abstract: Provided are a method and an apparatus for measuring an endolymphatic hydrops ratio of inner ear organs using an artificial neural network. The method of measuring an endolymphatic hydrops ratio includes obtaining a plurality of frame images obtained by capturing inner ear organs, obtaining a plurality of pieces of mask data corresponding to each of the plurality of frame images by inputting the plurality of frame images into a neural network, clustering the plurality of pieces of mask data according to the inner ear organs and obtaining representative images according to the inner ear organs according to certain conditions, and overlapping a target image synthesized by using the plurality of frame images and the representative images according to the inner ear organs so as to measure an endolymphatic hydrops ratio.

Abstract: Power management apparatuses are provided. A power management apparatus includes a secondary power device that includes at least one capacitor. The power management apparatus includes a charging circuit that includes a direct current (DC)-DC converter and that is configured to supply power to the secondary power device. Moreover, the power management apparatus includes a measuring circuit that is configured to measure a switching profile of the DC-DC converter, and to determine a state of the secondary power device by comparing at least one time period of the switching profile with a reference time. Related memory systems and methods of operation are also provided.

Abstract: A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected to the semiconductor chip, a thermal conductive layer disposed on the second surface of the semiconductor chip, a sealing layer surrounding a side surface of the semiconductor chip and a side surface of the thermal conductive layer, and a second redistribution portion disposed on the sealing layer, the second redistribution portion including a first upper wiring layer connected to the thermal conductive layer, the second redistribution portion including a second upper wiring layer electrically connected to the semiconductor chip.

Abstract: Power management apparatuses are provided. A power management apparatus includes a secondary power device that includes at least one capacitor. The power management apparatus includes a charging circuit that includes a direct current (DC)-DC converter and that is configured to supply power to the secondary power device. Moreover, the power management apparatus includes a measuring circuit that is configured to measure a switching profile of the DC-DC converter, and to determine a state of the secondary power device by comparing at least one time period of the switching profile with a reference time. Related memory systems and methods of operation are also provided.

Abstract: The present disclosure relates to a method for producing a synthesis gas using a solid acid, more particularly to a method for producing a synthesis gas using a solid acid capable of remarkably decreasing production of environmental pollutants such as carbon dioxide, which includes producing hydrogen by reacting a solid acid with water and producing a synthesis gas by reacting the produced hydrogen with a carbon compound.

Abstract: A power supply circuit includes a sequence control circuit configured to generate at least one control signal in response to a main power source, a voltage regulator circuit configured to be coupled to the main power source and to selectively generate at least one power supply voltage for a chipset from the main power source in response to the at least one control signal and a discharge circuit configured to discharge the voltage regulator circuit responsive to the at least one control signal.

Abstract: According to one embodiment of the present invention, a protective case for a mobile device comprises: a case body attached to the mobile device; and an external mount keypad unit which is arranged in the case body and which includes a plurality of key pads that are to be used in the mobile device.

Abstract: A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surface and the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive.

Abstract: The present disclosure relates to a method for producing a synthesis gas using a solid acid, more particularly to a method for producing a synthesis gas using a solid acid capable of remarkably decreasing production of environmental pollutants such as carbon dioxide, which includes producing hydrogen by reacting a solid acid with water and producing a synthesis gas by reacting the produced hydrogen with a carbon compound.

Abstract: Provided is a semiconductor package including a substrate and a semiconductor chip formed on the substrate. The semiconductor chip may include a chip alignment mark on a surface of the semiconductor chip, and wiring patterns formed on a surface of the substrate, wherein the chip alignment mark is bonded to the wiring patterns. Accordingly, the surface area of the semiconductor chip may be reduced.

Abstract: A semiconductor chip for a TAB package includes a surface including a set of input pads connected to internal circuitry of the chip and for receiving external signals The surface includes output pads. A plurality of input pads are adjacent a first edge and are in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads are adjacent a second edge, and are in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads are located between the first row and the second row. The plurality of second output pads include first and second outermost pads located a certain distance from a respective third edge and fourth edge, and first and second inner pads located a greater distance from the respective third edge and fourth edge.

Abstract: A semiconductor chip for a TAB package includes a surface including a set of input pads connected to internal circuitry of the chip and for receiving external signals The surface includes output pads. A plurality of input pads are adjacent a first edge and are in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads are adjacent a second edge, and are in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads are located between the first row and the second row. The plurality of second output pads first and second outermost pads located a certain distance from a respective third edge and fourth edge, and first and second inner pads located a greater distance from the respective third edge and fourth edge.

Abstract: A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip.

Abstract: A method for forming colloidal photonic crystals comprises; surrounding an outer circumference of a cylinder with a flexible substrate, spacing the cylinder a predetermined distance from a panel coated with a colloidal solution, and rotating the cylinder to form colloidal photonic crystals on the flexible panel.