Abstract: An information processing apparatus includes a data acquisition unit, a simulation execution unit, and an optimization unit. The data acquisition unit acquires execution result data including an execution result of the substrate processing based on a process parameter including a pressure in the substrate processing apparatus and including sensor data of the pressure in the substrate processing apparatus. The simulation execution unit inputs the execution result data into a simulation model pre-stored in a storage to calculate a pressure in the substrate processing apparatus that is predicted to approach a target value for a substrate processing result. The optimization unit calculates a predicted value of the substrate processing result based on the process parameter including the calculated pressure.

Abstract: A substrate processing apparatus includes: a substrate transfer controller that determines a placement condition of the substrate holder and a substrate placement position on the substrate holder based on a model, a substrate transfer position setting value, and a substrate holder setting value from the film thickness measurement result, and operates the substrate transfer device; an eccentricity status analysis unit that analyzes an eccentric state from a film thickness variation state; a learning function unit that updates the model based on the eccentric state; and an optimization function unit that updates the placement condition of the substrate holder and the substrate placement position on the substrate holder based on the updated model, the substrate transfer position setting value, and the substrate holder setting value.

Abstract: A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.

Abstract: A substrate processing apparatus that accommodates a substrate holder in which a substrate is placed in a processing container and forms a film onto the substrate, includes: a film thickness meter that measures a thickness of the film formed on the substrate; a state analysis unit that analyzes variation of the film thickness from a measurement result output from the film thickness meter at a plurality of measurement points where the film thickness on the substrate is measured; a singular point detection unit that, based on the analysis result, detects a measurement point where a difference from an adjacent measurement point deviates from a predetermined condition, as a singular point; and a singular point correction unit that corrects a measurement result of the singular point so that the difference of the film thickness between the singular point and the adjacent measurement point is within a predetermined condition.

Abstract: A license authentication device includes a memory that stores a license file including a license expiration date of an application that adjusts a parameter of a semiconductor manufacturing apparatus in a semiconductor factory; and a processor coupled to the memory. The processor acquires log data when the semiconductor manufacturing apparatus executes a processing; and determines whether or not a time included in the log data has passed the license expiration date stored in the license information storage.

Abstract: An information processing apparatus for controlling a conveying apparatus to convey a substrate to be processed by a substrate processing apparatus includes a processor that performs operations including controlling the conveying apparatus, according to teaching data, to perform a first movement operation including putting the substrate into a container configured to carry the substrate and a second movement operation including getting the substrate from the container, acquiring image data including an image of a placement position for the substrate in the container during the first movement operation and the second movement operation, performing image processing on the image data to quantify a relationship between a position of the container and a position of the substrate, determining the quantified relationship to yield a determination result, and outputting correction data for correcting the conveying apparatus with respect to the first movement operation and the second movement operation, based on the de

Abstract: A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.

Abstract: A deposition system includes a deposition apparatus configured to deposit a film on a substrate, and a control device. The control device includes a recipe storage unit configured to store a recipe that defines a procedure of a substrate processing process performed by the deposition apparatus, and a processor configured to calculate a predicted value of a change amount from a target value of a control target indicating a film thickness or a film quality of a film deposited in a deposition step included in the substrate processing process, by using log information about the deposition apparatus, the log information being collected from when the substrate processing process based on the recipe starts, and update the recipe based on the predicted value so as to change a value of the control target to approach the target value before the deposition step.

Abstract: A substrate processing apparatus includes a substrate transfer device that transfers a substrate accommodated in a substrate transfer container to a substrate holder; a substrate holder transfer stage that introduces the substrate holder into a reaction container; a substrate transfer controller that obtains a film thickness measurement result of the substrate, and determines a placing position of the substrate in the substrate holder by a model created in advance from the film thickness measurement result and a transfer position setting circuit; an information processing circuit that analyzes an eccentricity state from a film thickness variation state when a film thickness measurement result is newly obtained; a learning function circuit that updates the model from the eccentricity state; and an optimization function circuit that updates the placing position of the substrate by an updated model and the transfer position setting circuit.

Abstract: A control device includes a reception unit configured to receive a film characteristic at a plurality of positions of a film formed on a substrate by a film forming processing based on a processing recipe, an optimization processing unit configured to execute an optimization calculation of the processing recipe based on the film characteristic, a diagnosis unit configured to diagnose a validity of an in-plane shape of the film characteristic based on the film characteristic, and a determination unit configured to determine whether or not to notify a user of an encouraging action based on a diagnosis result by the diagnosis unit.

Abstract: A substrate processing apparatus that accommodates a substrate holder in which a substrate is placed in a processing container and forms a film onto the substrate, includes: a film thickness meter that measures a thickness of the film formed on the substrate; a state analysis unit that analyzes variation of the film thickness from a measurement result output from the film thickness meter at a plurality of measurement points where the film thickness on the substrate is measured; a singular point detection unit that, based on the analysis result, detects a measurement point where a difference from an adjacent measurement point deviates from a predetermined condition, as a singular point; and a singular point correction unit that corrects a measurement result of the singular point so that the difference of the film thickness between the singular point and the adjacent measurement point is within a predetermined condition.

Abstract: A substrate processing apparatus includes a substrate transfer device that transfers a substrate accommodated in a substrate transfer container to a substrate holder; a substrate holder transfer stage that introduces the substrate holder into a reaction container; a substrate transfer controller that obtains a film thickness measurement result of the substrate, and determines a placing position of the substrate in the substrate holder by a model created in advance from the film thickness measurement result and a transfer position setting circuit; an information processing circuit that analyzes an eccentricity state from a film thickness variation state when a film thickness measurement result is newly obtained; a learning function circuit that updates the model from the eccentricity state; and an optimization function circuit that updates the placing position of the substrate by an updated model and the transfer position setting circuit.

Abstract: A license authentication device includes a memory that stores a license file including a license expiration date of an application that adjusts a parameter of a semiconductor manufacturing apparatus in a semiconductor factory; and a processor coupled to the memory. The processor acquires log data when the semiconductor manufacturing apparatus executes a processing; and determines whether or not a time included in the log data has passed the license expiration date stored in the license information storage.