Abstract: A semiconductor device and a method for forming the same are provided. The method includes: providing a package including: a substrate including a first substrate surface and a second substrate surface opposite to the first substrate surface; a first conductive bump formed on the first substrate surface; and a first encapsulant disposed on the first substrate surface and encapsulating the first conductive bump; forming a groove in the first encapsulant to expose at least a portion of the first conductive bump; and forming a second conductive bump on the exposed portion of the first conductive bump using a laser soldering apparatus.

Abstract: Provided is a sensor assembly, comprising: a sensor, wherein the sensor comprises a sensor front surface comprising a sensor area and an interconnect area; at least one filter layer formed on top of the sensor front surface, wherein the at least one filter layer covers and is in direct contact with the sensor area of the sensor; a first encapsulant layer formed on top of the at least one filter layer, wherein the first encapsulant layer is transmissive to light; and wherein the interconnect area is at least partially exposed from the at least one filter layer and the first encapsulant layer.

Abstract: A semiconductor device has a first semiconductor package, second semiconductor package, and RDL. The first semiconductor package is disposed over a first surface of the RDL and the second semiconductor package is disposed over a second surface of the RDL opposite the first surface of the RDL. A carrier is initially disposed over the second surface of the RDL and removed after disposing the first semiconductor package over the first surface of the RDL. The first semiconductor package has a substrate, plurality of conductive pillars formed over the substrate, electrical component disposed over the substrate, and encapsulant deposited around the conductive pillars and electrical component. A shielding frame can be disposed around the electrical component. An antenna can be disposed over the first semiconductor package. A portion of the encapsulant is removed to planarize a surface of the encapsulant and expose the conductive pillars.