Patents by Inventor Younosuke Konemura

Younosuke Konemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210300004
    Abstract: Provided is a layered film having suitable easy-unsealability and having high sealing strength even under high temperature. A layered film with such suitable easy-unsealability and high sealing strength under high temperature includes a surface layer (A), an intermediate layer (B), and a seal layer (C), in which the surface layer (A) and the seal layer (C) each includes a polypropylene-based resin as a main component, the intermediate layer (B) includes a polypropylene-based resin (b1) and a polyethylene-based resin (b2), resin components in the intermediate layer (B) has a polypropylene-based resin (b1) content of 40 to 70% by mass and a polyethylene-based resin (b2) content of 30 to 60% by mass, the intermediate layer (B) has a thickness of 15% or less of the overall thickness of the layered film, and the seal layer (C) has a thickness of 15% or less of the overall thickness of the layered film.
    Type: Application
    Filed: September 21, 2017
    Publication date: September 30, 2021
    Applicant: DIC Corporation
    Inventors: Younosuke Konemura, Takashi Moriya
  • Publication number: 20200189232
    Abstract: An easily unsealable laminate film for use in bonding of a resin-based nonwoven fabric includes: a heat-seal layer (A) as one superficial layer to be bonded to the resin-based nonwoven fabric; an interlayer (B) that is laminated on the heat-seal layer (A) and includes, as resin components, an ethylene-based resin (b1) with a melt flow rate of 5 g to 50 g/10 min at 190° C. and a butene-based resin (b2); and a surface layer (C) as another superficial layer, wherein the resin components in the interlayer (B) have an ethylene-based resin (b1) content of 50 mass % to 80 mass % and a butene-based resin (b2) content of 20 mass % to 50 mass %. The easily unsealable laminate film can achieve preferred easy unsealability and a high sealing strength at a high temperature.
    Type: Application
    Filed: May 24, 2018
    Publication date: June 18, 2020
    Applicant: DIC Corporation
    Inventors: Yuki Kaburagi, Younosuke Konemura, Takashi Moriya