Abstract: Connector receptacles and related structures that can be hidden and protected, and that have a low-profile or shallow depth. An example can provide an electronic device having a connector receptacle, where the connector receptacle can be hidden using a cover. The cover can hide the connector receptacle and protect it from debris. The connector receptacle can also have a shallow depth making it suitable for use in small devices. Various cover mechanisms can be used. These cover mechanisms can be bistable, that is they can have a stable open position and a stable closed position. There can be tactile feedback provided to a user as the user moves the cover from the open position to the closed position and from the closed position to the open position.

Abstract: An input device, such as a stylus, can be operated to determine one or more conditions and select an appropriate operating mode. For example, a stylus can be attached to a host device when not in active use by a user. Attachment can be securely and releasably achieved with magnetic coupling. In such a configuration, the stylus can detect the attachment based on the presence and modification of magnetic fields. Based on such detection, the stylus can select an operating mode that allows power to be conserved when it is determined that certain components of the stylus need not be actively operated.

Abstract: Apparatus for improving substrate temperature uniformity in a substrate processing chamber are provided herein. In some embodiments, a cover plate for a substrate processing chamber includes: an outer portion; and a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.

Abstract: Methods and apparatus for chemical delivery are provided herein. In some embodiments, a first reservoir holds a first volume of fluid, receives a carrier gas, and outputs the carrier gas together with vapor derived from the first volume of fluid. A second reservoir holds a second volume of fluid and is capable of delivering a part of the second volume of fluid to the first reservoir. A self-regulating tube extends from the first reservoir to a region above the second volume of fluid in the second reservoir.

Abstract: Apparatus for improving substrate temperature uniformity in a substrate processing chamber are provided herein. In some embodiments, a cover plate for a substrate processing chamber includes: an outer portion; and a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.

Abstract: Methods and apparatus for chemical delivery are provided herein. In some embodiments, a first reservoir holds a first volume of fluid, receives a carrier gas, and outputs the carrier gas together with vapor derived from the first volume of fluid. A second reservoir holds a second volume of fluid and is capable of delivering a part of the second volume of fluid to the first reservoir. A self-regulating tube extends from the first reservoir to a region above the second volume of fluid in the second reservoir.

Abstract: The present invention provides methods and apparatus for processing semiconductor substrates with dual or multiple dopant inlets formed at different locations of an epitaxial chamber configured to supply dopant gases toward different locations of the substrate during deposition. In one embodiment, a gas delivery system configured to couple to an epitaxial deposition chamber includes a gas conduit has a first end and a second end configured to dispose in an epitaxial deposition chamber, the first end coupled to a gas panel and a second end branched out to include an auxiliary inner dopant inlet and an auxiliary outer dopant inlet, wherein the auxiliary inner dopant inlet and the auxiliary outer dopant inlet are independently controlled when implementing in the epitaxial deposition chamber.