Patents by Inventor Youqun SUI

Youqun SUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177057
    Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: November 16, 2021
    Assignee: Dongguan Littelfuse Electronics, Co., Ltd
    Inventors: Shuying Liu, Ming Lei, Guoliang Chen, Youqun Sui
  • Publication number: 20210027921
    Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.
    Type: Application
    Filed: October 15, 2020
    Publication date: January 28, 2021
    Applicant: Dongguan Littelfuse Electronics Company Limited
    Inventors: Shuying LIU, Ming LEI, Guoliang CHEN, Youqun SUI
  • Patent number: 10839993
    Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: November 17, 2020
    Assignee: Dongguan Littelfuse Electronics Company Limited
    Inventors: Shuying Liu, Ming Lei, Guoliang Chen, Youqun Sui
  • Publication number: 20200185134
    Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.
    Type: Application
    Filed: May 16, 2017
    Publication date: June 11, 2020
    Applicant: Dongguan Littelfuse Electronics Company Limited
    Inventors: Shuying LIU, Ming LEI, Guoliang CHEN, Youqun SUI