Patents by Inventor Youri VOLKHINE

Youri VOLKHINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Guard bond wires in an integrated circuit package
    Patent number: 10553543
    Abstract: An integrated circuit package is provided. The integrated circuit package comprises a first and second guard bond wire. The first guard bond wire has a first and second end coupled to ground. The second guard bond wire has a first and second end coupled to ground. The integrated circuit package further comprises a die. The die is mounted between the first and second guard bond wires such that the first and second guard bond wires distort a magnetic field between at least an input terminal and an output terminal of the die.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: February 4, 2020
    Assignee: Ampleon Netherlands B.V.
    Inventors: Vittorio Cuoco, Youri Volkhine, Yi Zhu, Josephus Van Der Zanden, Anna Walesieniuk
  • GUARD BOND WIRES IN AN INTEGRATED CIRCUIT PACKAGE
    Publication number: 20190006286
    Abstract: An integrated circuit package is provided. The integrated circuit package comprises a first and second guard bond wire. The first guard bond wire has a first and second end coupled to ground. The second guard bond wire has a first and second end coupled to ground. The integrated circuit package further comprises a die. The die is mounted between the first and second guard bond wires such that the first and second guard bond wires distort a magnetic field between at least an input terminal and an output terminal of the die.
    Type: Application
    Filed: May 12, 2016
    Publication date: January 3, 2019
    Inventors: Vittorio CUOCO, Youri VOLKHINE, Yi ZHU, Josephus VAN DER ZANDEN, Anna WALESIENIUK