Abstract: A concentrated photovoltaic and thermal system is disclosed. The system compromises a photovoltaic receiver assembly that produces highly concentrated solar energy, resulting in efficient energy conversion that requires fewer photovoltaic receivers than an arrangement that lacks such high concentration levels. The receiver assembly comprises a primary optical element that concentrates the source light onto an electromagnetic energy receiver, a secondary optical element to aid in further concentration of the light source, a thermal energy converter and a heat dissipation unit. The photovoltaic receiver assembly is preferably mounted on a tracking system to maximize sun exposure.

Abstract: The present invention relates to an antireflective coating comprising an amorphous silicon carbide-based film, which film further comprises hydrogen atoms and optionally further comprises oxygen and/or nitrogen, the film having an effective refractive index (n) between 2.3 and 2.7 and an extinction coefficient (k) of less than 0.01 at a wavelength of 630 nm. The present invention also relates to methods for preparing the antireflective coating and to solar cells comprising the antireflective coating.

Abstract: A method for forming a film on a substrate comprising: heating a solid organosilane source in a heating chamber to form a gaseous precursor; transferring the gaseous precursor to a deposition chamber; and reacting the gaseous precursor using an energy source to form the film on the substrate. The film comprises Si and C, and optionally comprises other elements such as N, O, F, B, P, or a combination thereof.

Abstract: A process for producing a pattern of negative electron beam resist comprises: depositing a layer of plasma polymerized fluoropolymer on a face of a substrate, the plasma polymerized fluoropolymer forming the negative electron beam resist; producing an electron beam; moving the electron beam on the layer of plasma polymerized fluoropolymer to define the pattern, the layer then having exposed fluoropolymer areas defining the pattern and unexposed fluoropolymer areas; and removing the unexposed fluoropolymer areas to leave only the pattern on the face of the substrate.

Abstract: A process for producing a pattern of negative electron beam resist comprises: depositing a layer of plasma polymerized fluoropolymer on a face of a substrate, the plasma polymerized fluoropolymer forming the negative electron beam resist; producing an electron beam; moving the electron beam on the layer of plasma polymerized fluoropolymer to define the pattern, the layer then having exposed fluoropolymer areas defining the pattern and unexposed fluoropolymer areas; and removing the unexposed fluoropolymer areas to leave only the pattern on the face of the substrate.