Abstract: A light-shielding body that shields incident light from an adjacent pixel is easily formed even in a case where the pixel is made finer. An imaging element is provided with a photoelectric conversion unit, an insulating film, an incident light transmitting film, and a light-shielding body. The photoelectric conversion unit is formed in a semiconductor substrate to perform photoelectric conversion of incident light from a subject and is arranged in a plurality of pixels. The insulating film is arranged on a plurality of pixels to insulate the semiconductor substrate. The incident light transmitting film is arranged adjacent to the insulating film of the plurality of pixels and transmits the incident light. The light-shielding body is arranged in a groove formed in the incident light transmitting film on a peripheral edge of each of the plurality of pixels to shield the incident light.

Abstract: The MEMS switch comprises a substrate with signal-lines having fixed-contacts, a movable-plate with a movable-contact, a flexible support-member supporting the movable-plate, a static-actuator and a piezoelectric-actuator configured to contact the movable-contact with the fixed-contact. The movable-contact is provided at its longitudinal center with the movable-contact, and its both the longitudinal ends with static-movable-electrode-plate. The support-member is four strips disposed on portions outside of the both width ends of the movable plate. The strip extends along the longitudinal direction of the movable plate, provided with a first end fixed to the movable plate, and provided with a second end fixed to the substrate. The piezoelectric-element is disposed on an upper surface of the strip to be located at a portion outside of the width ends of the movable-plate.

Abstract: A semiconductor structure provided with an insulation structure in a moving unit is manufactured easily. An optical scanning mirror (semiconductor structure) is formed by processing an SOI substrate consists of a first silicon layer, an oxide film and a second silicon layer. A moving unit, which is supported on a fixed frame through first hinges, is formed on the first silicon layer. The moving unit is divided into a plurality of regions by forming trenches (insulation structure). A supporting member formed of the oxide film and the second silicon layer is formed just below the trenches. The plurality of regions of the moving frame divided by the trenches are joined to the supporting member, so that the moving unit is swingable with the supporting member. Thereby, the supporting member is formed by simple etching processes, and thus, mechanical strength of the moving unit is ensured.

Abstract: The MEMS switch comprises a substrate with signal-lines having fixed-contacts, a movable-plate with a movable-contact, a flexible support-member supporting the movable-plate, a static-actuator and a piezoelectric-actuator configured to contact the movable-contact with the fixed-contact. The movable-contact is provided at its longitudinal center with the movable-contact, and its both the longitudinal ends with static-movable-electrode-plate. The support-member is four strips disposed on portions outside of the both width ends of the movable plate. The strip extends along the longitudinal direction of the movable plate, provided with a first end fixed to the movable plate, and provided with a second end fixed to the substrate. The piezoelectric-element is disposed on an upper surface of the strip to be located at a portion outside of the width ends of the movable-plate.

Abstract: A semiconductor structure provided with an insulation structure in a moving unit is manufactured easily. An optical scanning mirror (semiconductor structure) is formed by processing an SOI substrate consists of a first silicon layer, an oxide film and a second silicon layer. A moving unit, which is supported on a fixed frame through first hinges, is formed on the first silicon layer. The moving unit is divided into a plurality of regions by forming trenches (insulation structure). A supporting member formed of the oxide film and the second silicon layer is formed just below the trenches. The plurality of regions of the moving frame divided by the trenches are joined to the supporting member so that the moving unit is swingable with the supporting member. Thereby, the supporting member is formed by simple etching processes, and thus, mechanical strength of the moving unit is ensured.