Abstract: To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.

Abstract: To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.

Abstract: A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.

Abstract: A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.

Abstract: To provide a tape feeder capable of reducing absorption dislocation, a tape feeder according to the present invention is a feeder feeding a carrier tape including a plurality of component storage units of a rectangular shape provided at predetermined intervals in a feed direction. The tape feeder includes a first magnet which is provided below a bottom surface of the component storage unit fed to a feed region so as to extend in the feed direction below one side of the bottom surface of the component storage unit in a width direction, and which attracts a component of the component storage unit fed to the feed region to one side of the bottom surface of the component storage unit in the width direction.